Interview with vice chair of the IPC High-Speed/High-Frequency Committee

Tom Bresnan, R&D Circuits, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20. This interview was done by Ray Rasmussen of iConnect007 during IPC Midwest.

View the video here. This link will also allow you to view all of the iConnect007 videos taken during IPC Midwest.

Post a Comment

Required fields are marked *


%d bloggers like this: