Thermal modeling becomes Verizon’s hot issue

One of the largest U.S. telecom providers is touting two technologies, modeling and thermal management. Late last month at its annual equipment suppliers meeting, Verizon told its  hardware manufacturers they have to use thermal modeling when they design circuit boards and cabinets.
The telecom giant feels that using modeling, simulation and computational fluid dynamics to analyze heat generation and transference will help its customers in many ways. Lowering heat will reduce failures, cut air conditioning costs and sometimes even improve performance.
“Circuit boards can work fine when they are generating more heat than necessary, but they work better and save operating costs when you pay attention to heat issues up front,” said Chuck Graff, Verizon’s director of corporate network and technology.
The document calls for printed boards that withstand temperatures up to 85 degrees C and have glass transition temperatures of up to 130 degrees C. The edict could have a big impact on the way circuit boards are specified.
Verizon’s new Technical Purchasing Requirement, “Optimization of Telecom Networks Through Energy Efficiency,” will take effect next summer. It’s another big endorsement for model-based design, as if it needed further backing. The benefits of validating designs before the first prototype is built make so much sense it’s hard to find many reasons not to make the plunge.
Though telecom equipment has been in a slump the past couple years, its’ still a big business. Last year, worldwide revenue totaled $150 billion, according to Infonetics Research.

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