Common QFN, LGA Process Problems

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Common process problems for QFN and LGA components include floating during reflow, voiding and solderability. SMT process expert Bob Willis discusses solutions to these challenging issues. Click on this link or on Bob to view the video. 

Bob will be teaching a course at IPC Midwest on this topic, LGA and QFN Design, Assembly and Rework Guide on September 24. He will also teach Troubleshooting Your PCB Assembly Yields – On-site or Offshore. Sign up by August 21 and take $50 off the cost of attending one course. Learn more at www.IPCMidwestshow.org or www.IPCMidwestshow.org/register.

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