More tidbits from the standards meetings at IPC APEX EXPO

Although IPC has a wide range of services, we are certainly most well known for standards development. The marketing department was able to wrest these nuggets out of the tech staff as far as accomplishments made by the committees at the show on the PCB side. Many thanks to the hundreds of volunteers who attended the meetings and worked so diligently. We heard there was a standing room only meeting on moisture sensitivity that took place on the last day after the keynote. The dedication of our volunteers is impressive! We’ll try to post more as the debriefing continues:

  • IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards, (laminate and prepreg for rigid boards) should be ready for its release in mid-June of this year.  This revision adds eleven new specification sheets (a 20% increase).
  • IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry, should be released by early August.  Additionally, a new specification sheet that addresses a filled polyimide film product is scheduled for insertion, by amendment, into the current revision (IPC-4202) in mid-June.
  • IPC-4553A, Specification for Immersion Silver Plating for Printed Boards, is nearing its Ballot completion and is anticipated to be released by mid-May, 2009.  This latest revision clarifies the reduced offerings of immersion silver that are available to the industry as final finishes.
  • IPC-4412A, Specification for Finished Fabric Woven from “E” Glass for Printed Boards, will have an amendment inserted that will recommend a permittivity (dielectric constant) value for users of E-glass to predict the impact of resin content on the laminate’s dielectric properties.  A June release is anticipated.
  • Members of the D-33a/7-31a task groups met to prepare the IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards, and IPC-A-600H, Acceptability of Printed Boards, for Final Draft review in May 2009.  These revisions will address new requirements for cap plating in holes, new methodologies for thermal stress testing, and updated coating requirements, including lead-free solders.
  • The IPC 1-10b Current Carrying Capacity Task Group resolved comments to the Final Draft of the new IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design, expected to be balloted in May 2009.

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