IPC Study on North American PCB Industry Reports Growth in Military/Aerospace Market

Printed circuit boards (PCBs) for military and aerospace applications remain the largest vertical market segment for PCB manufacturers in North America, representing about one-third of the market. And it is the only vertical market segment expected to grow in 2016 as a share of the North American market, according to IPC’s 2016 Analysis and Forecast for the North American PCB Industry.

Other key findings include segmented market data showing that flexible circuit market growth has continued to outpace rigid PCB growth by a wide margin, but the negative growth rates seen in recent years in the rigid PCB market steadily diminished and growth turned positive in 2015. Estimated PCB production in North America declined 4.3 percent from 2014 to 2015, while estimated market growth was virtually flat, increasing just 0.4 percent.

The annual survey-based study provides a comprehensive overview of the market and business of PCB manufacturing in North America. It contains current data and analysis covering rigid PCBs and flexible circuits separately, including market and production growth, production and sales by product categories, prototype production, vertical markets and use of special technologies such as RF and embedded components. It also reports key financial and operational metrics including revenue per employee, capacity utilization, inventory turns and lead times. Forecasts of PCB production in the Americas and the world through 2017 from Dr. Hayao Nakahara, a leading industry analyst and consultant to the PCB industry, are included in the report.

The findings within the report result from data contributed by the companies that participated in IPC’s North American PCB Statistical Program in 2015 and year-end survey. Statistical program participants represent an estimated 51 percent of the North American PCB market.

The 57-page, downloadable report is available to IPC members for $450 and to nonmembers for $900. Participants in the year-end survey received a complimentary copy of the report. For more information or to purchase the 2016 Analysis and Forecast for the North American PCB Industry, visit www.ipc.org/PCB-Study-2016.

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com

Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. Also, this means that FOWLP is not just only for packaging baseband, RF transceiver, PMIC (power management IC), audio codec, etc., it can also be used for packaging large (125mm2) SoCs (system-in-chips) and high-performance chips such as APs.

As a matter of fact, a long list of companies such as Apple, MetiaTek, HiSilicon, and Qualcomm are queuing for TSMC’s 10nm/7nm process technology and their fan-out packaging technology. Other companies such as Samsung are also working on fan-out technology for their and others’ APs.

STATSChipPAC has been shipping more than 2-billion of FOWLP. ASE will be in volume (20,000 wafers per month) production of FOWLP by the end of 2016 SPIL will start volume production early 2017. PowerTech will start their panel-level fan-out packaging in Q2 2017.

With the popularity of SiPs (system-in-packages), fan-out (which can handle multiple dies) will be used more because the fan-in WLCSP (wafer-level chip scale package) can only handle single die.

In general, fan-out technology eliminates the wafer bumping, fluxing, flip chip assembly, cleaning, underfill dispensing and curing, and package substrate. Eventually, it will lead to a lower cost and profile packaging technology.

Recent advances in 3D IC integration (Hynix/Samsung’s HBM for AMD/NVIDIA’s GPU and Micron’s HMC for Intel’s Knights Landing CPU), 2.5D IC Integration (TSV-less interconnects and interposers), embedded 3D hybrid integration (of VCSEL, driver, serializer, polymer waveguide, etc.), and 3D MEMS/IC integration have been making impacts on the semiconductor advanced packaging.

On Monday, February 13, 2017, from 2:00 to 5:00 pm, I will give a professional development course, “3D Packaging and Fan-Out Wafer-Level Packaging at IPC APEX EXPO to be held at the San Diego Conference Center. Course contents are shown below. Please join me.

CONTENTS

  1. Introduction
  2. Fan-Out Wafer/Panel-Level Packaging(2) Fan-out Wafer/Panel-Level Packaging Formations
  3. (1) Patents Impacting the Semiconductor Packaging
  • Chip-first (die-down)
  • Chip-first (die-up)
  • Chip-last (RDL-first)
  • (3) RDL Fabrications
  • Polymer method
  • PCB/LDI method
  • Cu damascene method(5) TSMC InFO-PoP vs. Samsung ePoP(7) Notes on Dielectric and Epoxy Mold Compound(9) Wafer-Level System-in-Package (WLSiP)
  • (10) Package-Free LED (Embedded LED CSP)
  • (8) Semiconductor and Packaging for IoTs (SiP)
  • (6) Wafer vs. Panel Carriers
  • (4) TSMC InFO-WLP

(C) 3D IC Integration with TSVs

(1) Memory Chip Stacking – Samsung’s DDR4

(2) Hybrid Memory Cube (HMC) – Micron/Intel’s Knights Landing

(3) High Bandwidth Memory (HBM) – Hynix/AMD’s and Samsung/Nvidia’s GPU

(4) Chip stacking by TCNCF

(5) Samsung’s Widcon

(6) 3D IC/MEMS Integration

(7) Embedded 3D Hybrid Integration

(D) 2.5D IC Integration and TSV-Less Interposers

(1) TSMC/Xilinx’s CoWoS

(2) Xilinx/SPIL’s TSV-less SLIT

(3) SPIL/Xilinx’s TSV-less NTI

(4) Amkor’s TSV-less SLIM

(5) ASE’s TSV-less FOCoS

(6) MediaTek’s TSV-less RDLs by FOWLP

(7) Intel’s TSV-less EMIB

(8) ITRI’s TSV-less TSH

(9) Shinko’s TSV-less i-THOP

(10) Cisco/eSilicon’s TSV-less Organic Interposer

(11) Samsung’s TSV-less Organic Interposer

(E) Semiconductor Packaging New Trends

(F) Summary and Q&A

 

 

 

 

 

 

 

EPA Announces First Ten Substances to be Reviewed Under LSCA

On November 29, the U.S. Environmental Protection Agency (EPA) announced the first 10 chemicals that will be undergo risk evaluations under the recently reformed Toxic Substances Control Act (TSCA):

  •  1,4-Dioxane
  •  1-Bromopropane
  •  Asbestos
  •  Carbon Tetrachloride
  •  Cyclic Aliphatic Bromides Cluster
  •  Methylene Chloride
  •  N-methylpyrrolidone
  •  Pigment Violet 29
  •  Tetrachloroethylene, also known as Perchloroethylene
  •  Trichloroethylene

Many of the listed solvents, have been used in electronics manufacturing and may still be in use in certain locations and applications.

Under the Frank R. Lautenberg Chemical Safety for the 21st Century Act (LCSA) which amended TSCA, EPA must release a scoping document within six months for each chemical and complete the risk evaluations within three years.  Depending on the results of these risk evaluations, the EPA may then be required to ban one or all of these chemicals from the marketplace.

IPC will review the scoping document and actively participate in the risk evaluation process.

 

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports.

Base Materials

The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards. The group also decided that an Amendment 3 addressing another set of permissable substitutions consisting of (/98, /99, /101, /126) for specification sheet /129 in Table 3-10 should be Balloted. Finally, it was decided that rather than releasing all three Amendments added into revision D as: “IPC-4101D-wAM 1, 2 & 3”, these will be inserted into IPC-4101E revision to make the identification less complicated.

The 3-11f UL/CSA Task Group addressed the next UL STP meeting in San Diego at the APEX EXPO 2017. Pushing that which was initially discussed in Las Vegas 2016 APEX EXPO, it was decided that the meeting will occur on Thursday, February 16th as opposed to Friday, February 17th, 2017. It will be set for 9:00 am – 1:00 pm to allow some participants to fly home earlier, if they desire.

The 3-11g Corrosion of Metal Finishes Task Group discussed efforts that the task group is doing relative to mixed flowing gas studies and Flowers of Sulfur testing.

The 3-12a Metallic Foil Task Group announced that the non-contact surface roughness round robin testing (TM 2.2.22) successfully passed gauge R&R testing and NIST certification/traceability has been run and has proven to be statistically robust enough such that the 4 roughness coupons can be used as certified standards by foil suppliers and users to set-up their non-contact laser or optical measurement equipment. So far, response to an IPC questionnaire has resulted in a need for 25 sets (±2 sets) of certified coupons.

The 3-12d Woven Glass Reinforcement Task Group reviewed new spread glass data generated by JPS. Also, two new weave styles were submitted and discussed for inclusion into the IPC-4412B in its Appendices II via Amendment.

Assembly and Joining

The 5-23a Printed Circuit Board Solderability Specifications Task Group has completed what the group believes is a ballotable version of an Amendment 2 to J-Std-003C, Solderability Tests for Printed Boards to update the document.

The 5-23b Component and Wire Solderability Specification Task Group has generated the last comments for the E revision of J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires that should be acceptable for all three organizations supporting the document (EIA, JEDEC and IPC.)

The 5-24a Flux Specifications Task Group listened to a presentation by Graham Naisbitt of the IEC draft results of SIR testing and its impact on SIR testing using either or both the TMs 2.6.3.3 or 2.6.3.7 within the 5-24a Task Group. In later discussions it was suggested that both the test methods be considered for use, with decision to be left to the users to decide which SIR test method is to be applied by the user for their own needs. The final report of the IEC organization will be presented by Dr. Chris Hunt at IPC’s APEX EXPO 2017 Technical Conference.

The 5-24b Solder Paste Task Group reviewed all test methods utilized by the 5-24b Task Group and that all test methods were divided up between the task group’s membership for possible modifications. Later in October, these potentially modified test methods will be submitted along with any new GR&R results to the 7-11 Subcommittee for their approval for appropriate revisions to the IPC-TM-650 test methods.

The 5-24c Solder Alloy Task Group discussed the Amendment 1 to J-STD-006C and at what level of intentionally added alloying metals, rare earth metal or otherwise, need to be identified in the alloy composition. The members present decided that as long as the intentionally added alloying metal, is nominally at least 0.10% and known to, at least, ± 0.020% of the total alloy mass, it should be identified as a portion of the alloy.

Cleaning and Coating

The 5-32e Conductive Anodic Filament (CAF) Task Group celebrated the release of the revision B of the IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing.

The 5-33g Low Pressure Molding Task Group digressed a bit at their meeting by modifying the new standard, IPC-7621, Guideline for Design Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics should also utilize thermoset polymers for the encapsulation. Later, it is now recognized that currently, thermoplastics are predominant in the marketplace, so while thermosets are very likely to grow in their usage, the document needs to be released soon, utilizing the thermoplastics to best assist the marketplace.

Flexible Circuits

The D-13 Flexible Circuits Base Materials Subcommittee addressed the start of a Ballot on the IPC-4202B revision in early October. So far, the votes are coming in somewhat slowly. The subcommittee also began review of the IPC-4203 as its B revision, also.

The D-15 Flexible Circuits Test Methods Subcommittee continued review of the dimensional stability test method (TM 2.2.4D) and it is very near completion and soon to be sent to the 7-11 Subcommittee for their comments.

High Speed/High Frequency

The D-23 High Speed/High Frequency Base Materials Subcommittee addressed a two new materials for addition to the IPC-4103A; one from Japan and one from Israel. Both were determined to be in the series 200 laminates and are therefore added by the material suppliers and not requiring addition by Amendment and Ballot.

Court Issues Preliminary Injunction Halting DOL Overtime Rule

A federal judge on Tuesday blocked the Department of Labor final overtime rule that would double the minimum salary threshold for salaried employees, indefinitely postponing the December 1 effective date while he weighs challenges to the rule.

IPC has been mobilizing our members on this issue for months; and we’ve collaborated with the Partnership to Protect Workplace Opportunity, a broad-based business coalition, in advocacy and education efforts. We’ve brought IPC member company executives face-to-face with members of Congress to discuss the issue; encouraged your calls and letters; sent letters on behalf of all IPC; joined in coalition statements to Congress; and endorsed positive alternatives in Congress (S. 2707/H.R.4773).

As a result of the ruling:

  • Employers do not need to implement changes by the December 1, 2016 deadline, although the court, after hearing the full case, could allow the rule to go forward.
  • The incoming Trump Administration now has more time to make changes and end the rulemaking permanently or issue a new rule.
  • Congress could address the final overtime regulations during the lame duck or in the beginning of the 115th Congress.

The IPC Government Relations Team will continue to monitor this situation, advocate for your interests, and keep you informed.

If you want to weigh in, you can still take action today: Visit http://protectingopportunity.org/protecting-workplace-opportunity/#/4/ to add your names to the thousands of Americans who are petitioning Congress to block the DOL rule.

EU Reaches Final Agreement on Conflict Minerals Regulation

Today, at the end of the day in Europe, negotiators from the European Parliament, the Council of Ministers and the European Commission reached a final agreement on the Conflict Minerals Regulation. For the past five months, the Council and the European Parliament have been working together to implement a June political agreement on conflict minerals regulation.

According to a press release from the EU Commission Directorate General of Trade, the regulation will ensure sustainable sourcing for more than 95% of all EU imports of tin, tantalum, tungsten and gold, which will be covered by due diligence provisions as of 1 January 2021.

A blog entry by EU Commissioner for Trade Cecilia Malmström states that, “the agreed framework sets out clear, mandatory due diligence obligations for the critical so-called “upstream” part of the mineral supply chain, which includes those who import raw materials to smelting and refinery plants in the EU.”  Downstream operators who import refined, metal-stage products into the EU will also be covered by mandatory obligations.

The blog also mentions the development of reporting tools and standards to further boost due diligence in the supply chain, as well as setting up a transparency database. Through a review clause, there is also the possibility for the Commission to propose further mandatory obligations for the downstream supply chain if deemed necessary.

In the coming months and years, the Commission and Member States will work to make sure that the necessary structures are in place to ensure EU-wide implementation. Accompanying measures to provide support for importers, especially small and medium-sized enterprises, are also planned. Additionally, there will be a range of development aid and foreign policy actions to ensure the effectiveness of the regulation, and its positive impact on the ground. The agree regulation will now have to be formally adopted by the full European Parliament and the Council of Ministers.

We expect to have additional details within the next few days.

 

IPC Standards Committee Reports — Assembly and Joining, Product Assurance

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.

Assembly and Joining

The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at IPC APEX EXPO 2017.

The 5-21a Component mounting subcommittee met to discuss the update of the Guidelines for Printed Board Component Mounting. The new document, IPC-7070 will be created by combining parts of IPC-770, IPC-7351B, IPC-7093 and IPC-7095. The goal is to gather all the component information into one document to make it more user friendly.

The 5-21f Ball Grid Array Task Group continued its review of action items for IPC-7095D, Design and Assembly Process Implementation for BGAs. Particular focus at this meeting was spent on incorporating new information on column grid array (CGA) technology.

The 5-21g Flip Chip Mounting Task Group made the determination that it will go into full revision and not just an amendment for IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. A working draft IPC-7094A will be distributed to the task group before the end of 2016.

The 5-21h Bottom Termination Components Task Group reviewed a major overhaul proposed for the document for the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components. These changes are being led by Matt Kelly with IBM and Udo Welzel with Bosch, who will present a polished working draft for task group review and comment in early 2017. Additionally, Matt Kelly was named vice-chair of the task group, replacing Vern Solberg, who stepped down from this role after years of service.

The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. For the first time, the group also met at the same time with the Task Groups working on IPC-A-610, Acceptability for Electronic Assemblies and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies to resolve differences between the three documents addressing the same criteria.

The 5-22ad Requirements for Military Systems Work Group continued a discussion on content to address hardware contracted by the U.S. Department of Defense and used in military systems. They previously discussed a separate addendum, however during this meeting, they took action to review the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies. They are considering a joint effort with that Task Group.

The 5-22as Task Group discussed review comments from the Final Industry Review of the addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.

The 5-22f Task Group discussed comments to the document and prepared for a draft for Final Industry Review of the Handbook and Guide to Supplement J-STD-001.

The 5-22h Thermal Profiling Guide Task Group is preparing the ballot version of IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave), once all comments from the Final Draft for Industry Review have been resolved. The task group plans to ballot IPC-7530A by the end of October and to publish by APEX EXPO 2017. This will be the first revision since its publication in 2001.

The 5-22k Bottom Termination Components Test Methods Task Group reviewed comments from the working draft distribution of IPC-TM-650, Test Method 2.4.35, Dye and Pry Test Method. The task group approved the draft to go to the 7-11 Test Methods Subcommittee for comment. The group will also seek out companies and test labs to participate in a gage R&R for the test method.

Product Assurance

The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for IPC APEX EXPO 2017.

The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies.  The Task Group met to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31f Task Group met to discuss the comments received during the draft for final industry review period for IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group continued working IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620. 

The 7-31j Task Group continued working on a revision to IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures.

The 7-31m Fiber Optic Cable Acceptability Task Group met to discuss final changes and to resolve comments for IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies. The task group plans to ballot the draft standard by the end of the year, so it will be approved for publication before APEX EXPO 2017.

 The 7-34 Repairability Subcommittee reviewed comments submitted to IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies, during the draft for final industry review period.

 

 

EU Commission Launches Consultation on Two New Exemption Requests

The EU RoHS Directive 2011/65/EU restricts the use of certain hazardous substances in electrical and electronic equipment. BiPRO GmbH has been commissioned by DG ENV to provide technical assistance regarding the evaluation of applications and the related stakeholder consultations, for the following two new exemptions:

  • Cadmium in video cameras designed for use in environments exposed to ionising radiation and
  • Lead and cadmium in PVC profiles of electric windows and doors

The consultation for the two applications for exemption will be open until Friday, December 9, 2016. Questionnaires to the stakeholders containing targeted questions for the consultation have been drafted for each of the exemption requests and available for each exemption request respectively at: http://rohs.exemptions.bipro.de/exemption-consultations/2016-2/.

A dedicated project website has been established at http://rohs.exemptions.bipro.de/.

IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.

Printed Board Design

The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of parallel conductors and flexible circuits towards an update to the IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The proposed testing seeks participation from IPC member companies in conjunction with college and technical university laboratories.

The 1-10c Test Coupon and Artwork Generation Task Group worked towards future updates to the IPC-2221B Gerber Coupon Generator. The Generator allows for the creation of Gerber files for AB/R and D test coupon designs found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design, for plated hole integrity and registration evaluations. A propagated B/R design was discussed that will address additional via structures such as stacked and staggered.

Testing

The 7-12 Microsection Subcommittee met to resolve negative comments to the Proposed Standard for Ballot copy of IPC-9241, Guidelines for Microsection Preparation (formerly IPC-MS-810). A December 2016 release is anticipated. 

Flexible Circuits

The D-11 Flexible Circuits Design Subcommittee met to announce the publication of the new IPC-2223D, Sectional Design Standard for Flexible Printed Boards. Additions to this revision address flexible cross-sectional construction examples and factors that affect impedance and capacitance control for flex and rigid-flex printed board applications.

The D-12 Flexible Circuits Performance Subcommittee met to prepare the Final Draft for Industry Review of IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group addressed issues involving adhesive and strain relief fillets, non-lamination and dielectric protrusion within the rigid-to-flex transition zone. 

High Speed/High Frequency

The D-21 High Speed/High Frequency Design Subcommittee reviewed a Working Draft for the future IPC-2228, Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. The group agreed that any relevant design guidance from the older IPC-2251 and IPC-2252 design guide can be rolled into this document and that those two documents would be cancelled upon the release of IPC-2228. While there is certainly a need to address RF/Microwave design for flexible printed circuits, it was agreed that such content should be addressed with the corresponding IPC-2223 design standard for flexible printed boards and that IPC-2228 will reference that document.

The D-22 High Speed/High Frequency Performance Subcommittee met to announce the release of IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards and the corresponding IPC-6018CS Space and Military Avionics Applications Addendum. Both documents are targeted for a Q3 2016 release. These revisions provide updated acceptance criteria for microvia structures and PTFE laminates (e.g. smear removal).

The D-24b Bereskin Test Methods Task Group met work on a new IPC-TM-650 Test Method addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz.

The D-24c High Frequency Test Methods Task Group meet to review a proposal for a new IPC-TM-650 test method addressing microstrip differential phase length useful for approximating Dk over a wide range of frequencies.

The new D-24d High Frequency Signal Loss Task Group met for the first time to discuss a proposed test method addressing the quality of measured date for printed boards to meet the demands of high speed applications of 25Gbps and above.   The effort will address verification of the accuracy of measured data, calibration and de-embedded techniques, and probing/test fixture choices that impact measurement quality. 

Rigid Printed Boards

The D-31b IPC-2221/2222 Task Group met to advance the working draft of IPC-2226A, Sectional Design Standard for HDI Printed Boards, which is the first revision effort for this standard since its original 2003 publication. The group focused on sections and graphics for various structures, included stacked, staggered and variable depth microvias. A Final Draft for Industry Review is planned for release for review and comment by December 2016.

The D-33a Rigid Printed Board Performance Task Group and the 7-31a IPC-A-600 Task Group met jointly to work on a future Revision E to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, including copper wrap plating, evaluations for surface finishes in production lot testing, back drilling and via fill “plate-to-plate”, often referred to as “double capping”.

The D-32 Thermal Stress Test Methods Subcommittee met to work on revisions to IPC-TM-650 Methods 2.6.7.2, Thermal Shock and 2.6.27, Thermal Stress. The test methods are being updated to address in process electrical resistance measurements of samples during thermal cycling.   A significant set of data correlating the electrical resistance measurements to failures occurring during thermal cycling was provided by Jerry Magera of Motorola Solutions.

 

In Memoriam — P. Douglas Lyle, Ph.D.

douglyle

 

Long-time IPC volunteer, P. Douglas (Doug) Lyle, Ph.D.,71, passed away on October 10, 2016. Doug was an active participant on the 3-10 Printed Board Base Materials Committee, 3-12d Woven Glass Reinforcement Task Group and 7-11b Base Materials Test Methods Task until his retirement from Advanced Glass Yarns (AGY).

Doug will be missed by his former fellow committee members, IPC staff and his colleagues in the electronics manufacturing industry.