Tag Archives: IPC-6012

IPC Standards Progress Reports – Boards, Embedded, Flex and More

November 29, 2010 – 4:35 pm

2010 IPC Electronics Midwest Standards Development Committees Progress Reports Following are brief summaries of select committees, subcommittees and task groups. BASE MATERIALS The 3-11 Laminate/Prepreg Materials Subcommittee continued its work on Amendment 1 to IPC-4101C, Specification for Base Materials for Rigid and Mulitlayer Printed Boards. This meeting covered: 1) the inclusion of DMA testing for [...]

By Kim Sterling | Posted in Boards, Design, IPC, Standards | Also tagged , , , | Leave a Comment

PCB Multi-Issue Microsection Wall Poster

November 22, 2010 – 2:35 pm

A gift for the holidays for the PCB department that has everything! Dubbed the “nightmare microsection,” this full-color, 24×36-inch (60 x 90 cm) wall poster identifies 42 phenomena that can be seen in cross-sections of plated-through holes. Outstanding visual for supporting discussions of common (and not so common) phenomena. All defects are labeled and match [...]

By Kim Sterling | Posted in Boards, Technical | Also tagged , , , | Leave a Comment

Change documents available for IPC-A-610E, J-STD-001E, IPC-A-600H and IPC-6012C

April 14, 2010 – 2:05 pm

What’s new in the newest IPC revisions? IPC has made it easier than ever for you to start using the new documents. Visit www.ipc.org/610 or www.ipc.org/001 to download a free change document (.pdf) showing all of the differences in each document and/or a fact sheet (.pdf) that summarizes the edits. Visit www.ipc.org/600 or www.ipc.org/6012 to [...]

By Kim Sterling | Posted in Standards | Also tagged , , | Comments (2)

Now Available! IPC-A-600H, IPC-6012C, IPC-A-610E, IPC J-STD-001E

April 2, 2010 – 4:12 pm

The new revisions are now available. IPC-A-610E – Acceptability of Electronic Assemblies IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronic assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on [...]

By Kim Sterling | Posted in Assembly, Boards, Standards | Also tagged , , , | Comments (8)

IPC-A-600 and IPC-6012 Standards Revisions to Debut at IPC APEX EXPO

March 22, 2010 – 1:12 pm

View Video Technical Project Manager John Perry discusses upcoming publication of the two most widely-used IPC standards for the printed board industry, IPC-A-600H and IPC-6012C,  at IPC APEX EXPO. Perry delivers in-depth analysis of what is being revised within each standard, both of which have not been updated since 2004. The standards have been revised [...]

By Kim Sterling | Posted in Boards, Standards, Technical | Also tagged , , | Leave a Comment

What happens in Phoenix… gets reported right here

January 29, 2010 – 9:44 am

Select IPC committees held a productive week of meetings in Phoenix in mid-January. Each staff liaison has been asked to share the progress made. John Perry, IPC technical project manager, reported in on his printed board committees below. Printed Board Design The IPC 1-10c Test Coupon and Artwork Generation Task Group met to review a future [...]

By Kim Sterling | Posted in Boards, Committees, Standards, Technical | Also tagged , , , , , , , , , , , , | Leave a Comment
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