Tag Archives: IPC-4552

IPC standards committee updates: printed board design, base materials, fabrication processes and high speed/high frequency

Printed Board Design The IPC 1-10b Current Carrying Capacity Task Group discussed goals for a future revision to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The revision will focus on high current transients, flexible printed boards, microvia structures and new printed board material types. The IPC 1-10c Test Coupon and Artwork […]

IPC Publishes 3 new documents in German, one in Chinese

4552-DE, Spezifikation für chemisch Nickel/Gold (ENIG) für Oberflächen von Leiterplatten. This is the German translation of Specification for Immersion Silver Plating for Printed Boards.  4554-DE, Spezifikation für chemisch Zinn-Oberflächen von Leiterplatten (German). This is the German translation of Specification for Immersion Tin Plating for Printed Circuit Boards.  6013B-DE, Qualifikation und Leistungsspezifikation für flexible Leiterplatten (German). […]

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