Category Archives: Technical

Creating a Battery Declaration Standard

May 4, 2012 – 9:59 am

Kelly St. Andre, PTC, discusses the newly formed 2-18g Declaration of Batteries and Battery Materials Task Group and its work on creating a battery declaration standard. Watch the video now.

By sandygentry | Also posted in Committees, Standards | Tagged , , , | Leave a Comment

Peering into X-ray inspection

April 19, 2012 – 3:34 pm

Testing is becoming more difficult as densities rise and more of the solder connections are hidden from view. X-ray inspection is one of the techniques that pays big dividends, but getting the best results takes a fair amount of planning. X-ray inspection is seeing more usage, providing complementary benefits when it’s used with a range [...]

By Terry Costlow | Also posted in Assembly | Tagged , | Leave a Comment

IPC APEX EXPO Standards Development Reports: Flex Circuits

April 18, 2012 – 2:24 pm

 These committee reports from IPC APEX EXPO have been compiled to help you keep up on IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Here are the flex circuit [...]

By Kim Sterling | Also posted in Committees, Standards | Tagged | Leave a Comment

Some solutions for intermittent problems

April 11, 2012 – 10:24 am

Intermittent field problems are among the most expensive warranty issues to handle. It can take years to find the root cause, then figuring out a solution to eliminate the problem can be difficult. So it’s pretty wise to take steps to avoid problems that cause sporadic failures. One of these, tin whiskers, has been vexing [...]

By Terry Costlow | Also posted in Assembly, electronics, Training | Tagged , | Leave a Comment

IPC APEX EXPO Committees: IPC Roadmap and JNAC reports

April 10, 2012 – 11:02 am

Roadmap The 8-41 Roadmap Subcommittee released the IPC Technology Roadmap for 2011  just prior to IPC APEX EXPO and officially began the process of creating the 2013 release. The subcommittee spent an all-day work session confirming the new, distributed-processing work model for the 2013 release and began assigning chapter team leaders and sub-chapter contributors, as [...]

By Kim Sterling | Also posted in electronics, OEM, Standards | Tagged , | Leave a Comment

Flex market requires focused strategies

April 3, 2012 – 1:47 pm

Circuit board bookings seem to be on the upsurge, but it still takes a lot of strategic planning to expand market share. Flex circuits are an area where growth can come if companies use tactics that are tailored to this segment of the industry. Many segments of the North American printed circuit board industry are [...]

By Terry Costlow | Also posted in Boards | Tagged , , | Leave a Comment

IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

March 30, 2012 – 9:10 am

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Assembly and Joining The 5-21e [...]

By Kim Sterling | Also posted in Assembly, Boards, Committees, Standards | Tagged , , , , | Leave a Comment

Sharpen those pencils – IPC APEX EXPO Call for Papers Needs You!

March 28, 2012 – 9:09 am

Proposals/Abstracts Due May 4 Technical Conference: February 19-21, 2013 Professional Development Courses: February 17-18, 21, 2013 San Diego Convention Center, San Diego, Calif. Submit an abstract for the industry’s premier technical conference or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2013 in San Diego provides significant [...]

By Kim Sterling | Also posted in Assembly, Boards, Trade Show | Tagged , | Leave a Comment

Trimming a problem

March 27, 2012 – 11:13 am

Tin whiskers have been a problem for this industry since the introduction of lead-free solders, but techniques for eliminating them have proven elusive. As research hunt for a universal solution, they’re continually finding new techniques that reduce the chances that these vexing growths will cause problems in the field. For example, the United Kingdom’s National [...]

By Terry Costlow | Also posted in Assembly | Tagged | Leave a Comment

IPC APEX EXPO® Standards Development Reports: Printed Electronics

March 23, 2012 – 9:42 am

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in technology that affects your company. For more information on these committees, contact Marc Carter or Dieter Bergman. You can also visit www.ipc.org/committees for more information on IPC standards development, drafts and minutes. The D-61 Printed Electronics Design Subcommittee worked [...]

By Kim Sterling | Also posted in Boards, Standards, Trade Show | Tagged | Leave a Comment
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