Category Archives: Boards

Is In-house PCB Prototyping for Everyone?

April 30, 2012 – 9:19 am

Is in-house prototyping of printed circuit boards for everyone? Here’s a quick look at the pros and cons of this technology. To learn more about prototyping printed circuit boards in-house, register for the IPC webinar PCB Prototyping: In-house v. Outsource live at 11:00 am EST, Thursday, May 10. Josh Brown, market development representative, LPKF Laser [...]

By sandygentry | Tagged , | Leave a Comment

Flex market requires focused strategies

April 3, 2012 – 1:47 pm

Circuit board bookings seem to be on the upsurge, but it still takes a lot of strategic planning to expand market share. Flex circuits are an area where growth can come if companies use tactics that are tailored to this segment of the industry. Many segments of the North American printed circuit board industry are [...]

By Terry Costlow | Also posted in Technical | Tagged , , | Leave a Comment

IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

March 30, 2012 – 9:10 am

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Assembly and Joining The 5-21e [...]

By Kim Sterling | Also posted in Assembly, Committees, Standards, Technical | Tagged , , , , | Leave a Comment

IPC APEX EXPO Standards Development Reports: Rigid Boards, Embedded Devices, Design and Data Transfer

March 29, 2012 – 12:30 pm

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Printed Board Design The 1-10c Test [...]

By Kim Sterling | Also posted in Committees, Standards | Tagged | Leave a Comment

Sharpen those pencils – IPC APEX EXPO Call for Papers Needs You!

March 28, 2012 – 9:09 am

Proposals/Abstracts Due May 4 Technical Conference: February 19-21, 2013 Professional Development Courses: February 17-18, 21, 2013 San Diego Convention Center, San Diego, Calif. Submit an abstract for the industry’s premier technical conference or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2013 in San Diego provides significant [...]

By Kim Sterling | Also posted in Assembly, Technical, Trade Show | Tagged , | Leave a Comment

IPC APEX EXPO® Standards Development Reports: Printed Electronics

March 23, 2012 – 9:42 am

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in technology that affects your company. For more information on these committees, contact Marc Carter or Dieter Bergman. You can also visit www.ipc.org/committees for more information on IPC standards development, drafts and minutes. The D-61 Printed Electronics Design Subcommittee worked [...]

By Kim Sterling | Also posted in Standards, Technical, Trade Show | Tagged | Leave a Comment

Building Long-term Reliability into Printed Circuit Boards

January 23, 2012 – 2:35 am

By Mike Carano, OMG Electrochemicals Inc. The threat to the reliability of printed circuit boards (PCBs) comes primarily from one source — the temperatures required during the soldering processes for the assembly of the components onto the PCB. These reliability issues can be mitigated if fabricators understand the ramifications of the material sets chosen for [...]

By Kim Sterling | Tagged , , | Leave a Comment

Smart ideas for protecting intellectual property

January 20, 2012 – 1:10 pm

Hackers and corporate thieves have helped make information security a topic that can’t be overlooked, especially in competitive fields like electronics. In North America, where many printed circuit board manufacturers target markets like defense and early prototyping, security is more critical than in areas that make high volume throw-away products. For years, the two leading [...]

By Terry Costlow | Also posted in Certification | Tagged | Comments (1)

IPC standards committee reports: materials, boards, embedded, flex

November 7, 2011 – 10:14 am

This is part of a series of updates from IPC standards committee meetings at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee worked on amending IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards. Proposed items for inclusion were: a) adding DMA thermal analysis testing for measurement of Tg; b) inserting the [...]

By Kim Sterling | Also posted in Committees, Standards | Tagged , , , , , , , , , , , | Comments (2)

IPC Standards Committee Reports: Design, Data Transfer, Documentation, high speeD, high frequency

November 1, 2011 – 11:04 am

IPC Standards Committee Reports from IPC Midwest Conference & Exhibition Printed Board Design The 1-10b Current Carrying Capacity Task Group discussed revisions to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The task group wants to tap into industry testing for high current, high pulse applications, as well as flexible circuit technology [...]

By Kim Sterling | Also posted in Committees, Design, Standards | Tagged , , , , , , , , , , , , | Leave a Comment
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