Category Archives: Assembly

Cleaning up PoP

May 9, 2012 – 9:20 am

As package on package technology moves deeper into the mainstream electronics, issues like cleaning are getting much more attention. PoP’s impressive growth, driven in large part by high volume portables like cameras and cell phones, requires fine densities that make it difficult to remove residues after soldering. Zestron America recently did some studies of cleaning [...]

By Terry Costlow | Tagged , | Leave a Comment

Are Counterfeit Components Really a Problem?

April 27, 2012 – 9:02 am

By Tony Hilvers, IPC Vice President of Industry Programs Periodically, an industry publication will breathlessly report a story about the incredible cost of counterfeit components. It’s very exciting news. For example, according to an IHS ISupply study, “The risks of counterfeit semiconductors are both financially high and potentially fatal. The components represent $169 billion in [...]

By Kim Sterling | Tagged | Comments (14)

Stencil Design Guidelines IPC-7525B Update

April 20, 2012 – 12:48 pm

Dr. William Coleman, recent recipient of the IPC’s President’s Award, talks to guest editor Kelly Dack about the history of the IPC-7525 Stencil Design Guidelines spec, what is included and how it has recently changed with the times in this recent video interview. View the video now!

By Kim Sterling | Tagged , | Comments (2)

Peering into X-ray inspection

April 19, 2012 – 3:34 pm

Testing is becoming more difficult as densities rise and more of the solder connections are hidden from view. X-ray inspection is one of the techniques that pays big dividends, but getting the best results takes a fair amount of planning. X-ray inspection is seeing more usage, providing complementary benefits when it’s used with a range [...]

By Terry Costlow | Also posted in Technical | Tagged , | Leave a Comment

Changes to IPC-9850, Surface Mount Placement Equipment Characterization

April 12, 2012 – 10:27 am

Panasonic’s Michael Cieslinski, chair of the 5-41 IPC SMT Component Placement Equipment Subcommittee that recently revised IPC-9850 to revision A, discusses the key changes made in the standard in this video interview, such as simplifying stages and adding more components, as well as how the specification was organized to allow for expansion with future technologies. Watch it [...]

By Kim Sterling | Tagged | Leave a Comment

Some solutions for intermittent problems

April 11, 2012 – 10:24 am

Intermittent field problems are among the most expensive warranty issues to handle. It can take years to find the root cause, then figuring out a solution to eliminate the problem can be difficult. So it’s pretty wise to take steps to avoid problems that cause sporadic failures. One of these, tin whiskers, has been vexing [...]

By Terry Costlow | Also posted in electronics, Technical, Training | Tagged , | Leave a Comment

New Book by Bob Willis Available for Free Download: Pin In Hole Reflow (PIHR) Technology

April 7, 2012 – 2:25 pm

Pin in Hole Reflow, Pin In Paste, Multi Spot Soldering, Intrusive Assembly – What’s in a name? If you have an interest in Pin in In Hole Intrusive Reflow, Design and Assembly, frequent IPC contributor Bob Willis of the “IPC/NPL Defect of the Month” has a new book out for free download at www.pihrtechnology.com “Once again [...]

By Kim Sterling | Tagged , , | Leave a Comment

IPC Standards Development Reports: Product Reliability, Test, Process Control and Product Assurance

April 4, 2012 – 1:42 pm

These committee reports from IPC APEX EXPO should help you keep up on IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Product Reliability The 6-10c Plated-Through Via (PTV) Reliability Task [...]

By Kim Sterling | Also posted in Standards | Tagged , , , | Leave a Comment

IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

March 30, 2012 – 9:10 am

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Assembly and Joining The 5-21e [...]

By Kim Sterling | Also posted in Boards, Committees, Standards, Technical | Tagged , , , , | Leave a Comment

Sharpen those pencils – IPC APEX EXPO Call for Papers Needs You!

March 28, 2012 – 9:09 am

Proposals/Abstracts Due May 4 Technical Conference: February 19-21, 2013 Professional Development Courses: February 17-18, 21, 2013 San Diego Convention Center, San Diego, Calif. Submit an abstract for the industry’s premier technical conference or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2013 in San Diego provides significant [...]

By Kim Sterling | Also posted in Boards, Technical, Trade Show | Tagged , | Leave a Comment
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