NCEDAR 2012 Makes an Impressive Debut

IPC India successfully accomplished its goal of providing the Indian electronics manufacturing industry with state-of-the-art technologies in printed board design and manufacturing. More than 350 participants attended National Conference on Electronics Design, Assembly and Reliability (NCEDAR), held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India.

The three-day event opened with a day of workshops on December 4, targeting critical trends and technology. Mukul Luthra, Waterfall Technologies, addressed SMT process development and yield enhancement involving advanced package assembly; Dr. Girish Pathak, CMET, provided an overview on electronic packaging materials and processes; and S. L. N. Murthy, Tech Labs, covered signal and power integrity aspects of high-performance designs.

Industry experts presented 36  technical papers during technical conference sessions December 5–6 and focused on six areas of advanced electronics: design, simulation and modeling; electronic components, RF and optoelectronics; PCB assembly and manufacturing technology; materials and processing; reliability and quality control; and advanced packaging including interconnections.

Nineteen exhibitors including Altium, GOEPEL Electronic, Hakko, Kyzen, Mentor Graphics and Sienna Corporation were on-hand to present equipment, systems and supplies to help attendees solve electronics manufacturing challenges. Special events during the conference included an opening keynote by Dr. V.K. Aatre, former scientific advisor to Raksha Mantri at the India Ministry of Defense, three additional keynote sessions, a PCB design contest and an IPC Hand Soldering Competition which saw 36 participants compete in a heated battle. Prashanth Raje Urs, M/S Rangsons, was crowned victor of the India championship and will go on to compete in the IPC WORLD CHAMPIONSHIP at IPC APEX EXPO® in February.

“All in all, this inaugural event was highly informative, productive and specifically addressed the needs of the Indian electronics manufacturing industry. NCEDAR represented IPC’s commitment to bringing additional services and educational opportunities to India,” says David Bergman, IPC vice president of international relations. “It provided a new venue for industry professionals to expand their skills, share their expertise and find solutions.”

Based on the success of the inaugural NCEDAR event, IPC India will host NCEDAR 2013 in Pune, India in December.

Ribbon cutting ceremony

Ribbon cutting ceremony

Lamp lighting ceremony

Lamp lighting ceremony

Hand soldering competition inauguration

Hand soldering competition inauguration

Hand soldering competition

Hand soldering competition

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