Enthusiasm Marks the IPC Difference

June 14, 2013 – 1:28 pm

All too often, we’re forced to deal with people who are largely apathetic about their jobs, or those who pay little attention to detail. One of the refreshing aspects of IPC involvement is the high level of interest and enthusiasm throughout the volunteer organization and the staff.

I was reminded of this when I spoke to someone I haven’t spoken with in a fair while. IPC’s Dieter Bergman has the enthusiasm of a child, living up to Aldous Huxley’s observation that “the secret of genius is to carry the spirit of the child into old age, which means never losing your enthusiasm.”

Dieter always offers the time to explain things fully, giving you a chance to ask questions as necessary. It’s easy to tell that he’s driven to make sure that anything he’s involved in is done as well as is possible.

That’s another trait that’s common throughout IPC. The association knows the value of compromise, working to get the best standard, document or other project that’s possible. Not the best that they can do without much concern for what others think, but what’s the best that can be done with support of the group.

Dieter’s boyish enthusiasm and his push to get the best outcome is a great reminder of the effort that goes into every IPC project. Not to mention that it makes committee meetings far more enjoyable than they might have a right to be. Hats off to the volunteers and staff who have something that’s all too often missing: They understand the value of a good attitude.

By Terry Costlow | Posted in Technical, Committees, Standards, IPC, Membership | Tagged , , | Leave a Comment

IPC Issues Third Set of Comments on List of Restricted Substances under RoHS2

June 14, 2013 – 9:38 am

On June 10, 2013, IPC submitted its third set of comments on the draft methodology for evaluating substances for restriction under Annex II of the RoHS2 Directive. IPC stressed the importance of evaluating both hazard and exposure characteristics of a substance and potential alternatives prior to restricting a substance. IPC has remained engaged in the development of the methodology for evaluating substances for restriction under the RoHS2 Directive

The stakeholder consultation on the review of substances for restriction under Annex II of the RoHS2 Directive began on January 20, 2013. IPC submitted comments applauding the EU Commission for supporting the use of a scientific methodology and encouraged the Commission to first establish the methodology before asking stakeholders to submit substances they believe are harmful.

However, the first draft methodology released in February 2013, did not reflect the EU Commission’s previously stated goals. On March 11, 2013, IPC submitted comments expressing concern that the draft methodology would not result in the development of a strong, scientifically based methodology for the review of restricted substances under RoHS2, as outlined in Article 6 of the RoHS 2 Directive (2011).

On April 15, 2013, IPC submitted joint technical comments with SEMI (Semiconductor Equipment and Materials International) suggesting the use of an alternative approach to evaluating substances for restriction under the RoHS2 Directive. These comments can be viewed by visiting www.umweltbundesamt.at/rohs2. On April 30, 2013, IPC and SEMI met with the RoHS2 desk officer to discuss those comments.

During the RoHS revisions process, IPC successfully lobbied for the revised Directive to be scientifically based. As a result, the Commission did not implement additional substance restrictions under the revised RoHS Directive. The Commission is required to complete its review of Annex II by July 2014. IPC will remain engaged in the review process. For more information, contact Stephanie Castorina, IPC manager of environmental programs, at +1 703-522-0225.

 

By Sandy Gentry | Posted in Environment, Health and Safety, IPC, Regulations | Tagged , , , , | Leave a Comment

Infrastructure has a Bearing on Manufacturing Equipment

June 6, 2013 – 7:27 am

Manufacturing equipment and systems today are incredibly sophisticated, as well as incredibly complex. Keeping them running at maximum efficiency is a difficult task that requires constant monitoring of subtle activity on key components.

Manufacturers at every level, whether they’re making printed boards, electronic systems or cardboard boxes, need to make sure that equipment runs nonstop until it’s time for scheduled maintenance. Equipment and component makers move in many directions to monitor equipment to determine when it might be heading toward failure.

Ball bearings are usually considered a minor segment of the infrastructure, but they are a critical component in most manufacturing equipment. SKF, the Swedish manufacturer that’s one of the largest bearing suppliers, discussed a novel new technology at a press meeting earlier this week.

SKF is putting the final touches on a bearing that includes a wireless link that regularly sends information on the bearing’s vibration and temperature. Those parameters tell whether spindles and other moving parts are performing at normal levels. When bearings are getting hot or vibrating too much, it’s probably time to schedule maintenance.

Board fabricators and electronic manufacturing services suppliers know that components that seem to be simple infrastructure components have to perform precisely or complex systems will fail. When companies come up with innovative technologies that give these basic components new capabilities, everyone benefits.

By Terry Costlow | Posted in Boards, electronics | Tagged , , , , | Comments (1)

SEC Issues FAQ Document on Conflict Minerals Regulation

May 31, 2013 – 3:21 pm

On May 30, 2013, the U.S. Securities and Exchange Commission (SEC) issued a Frequently Asked Questions (FAQ) document on the conflict minerals regulation. The FAQ document answers 12 questions on various aspects of the conflict minerals regulation, including clarification on contract to manufacture provisions, applicability of the regulation, and “Form SD.” The FAQ document is not intended to serve as a rule, regulation or statement of the SEC.

To address the industry’s growing need for information, IPC has developed a number of tools to help companies understand the regulation and develop an effective conflict minerals program.

IPC’s Conflict Minerals Due Diligence Guide covers information from who to include on a company’s conflict minerals team to what to include in a company policy statement. The guide also lays out steps for identifying and prioritizing suppliers. Due to the complexity of the electronics supply chain it is imperative to identify key suppliers in order to ensure those suppliers are thoroughly vetted for conflict minerals information. This guide includes vital information on ensuring due diligence compliance is met as required by the SEC regulation.

For additional information on conflict minerals and IPC’s advocacy efforts, visit www.ipc.org/conflict-minerals.

By Sandy Gentry | Posted in IPC, Regulations | Tagged , , | Leave a Comment

Manufacturing Moves Show Promise

May 30, 2013 – 12:06 pm

Apple recently announced plans to beef up its domestic manufacturing by investing $100 million in a production facility in Texas. Though there are plenty of questions about the state of manufacturing in the United States, Apple’s plan highlights the strength of American factories.

U.S. manufacturers are taking steps to remain competitive with low-cost countries, employing robots and adopting new techniques like additive manufacturing. Recently, the Robotic Industries Association (RIA) reported that first quarter shipments in North America totaled 5,736 units valued at $369.5 million. That shattered last year’s records for the first quarter by 24 percent in units and 23 percent in dollars.

The United States also has a strong position in the hot new area of additive manufacturing. The Wohlers Report 2013 said that 38 percent of all industrial additive manufacturing installations are in the United States. That’s substantially higher than the 10 percent level for both Japan and Germany.

The circuit board industry is also showing mostly positive signs. PCB orders in North America increased 7.2 percent year-over-year in April, while the book-to-bill ratio rose to 1.10, a 34-month high. The latter figure bodes well for PCB sales in the next two quarters.

Monthly data is available in the IPC North American PCB Market Report. More information is available at www.ipc.org/market-research-subscriptions.

By Terry Costlow | Posted in IPC | Tagged , , , , | Leave a Comment

Additive Processes Move into High Reliability Environments

May 24, 2013 – 8:27 am

It’s almost becoming difficult to pick up a magazine or newspaper without reading about the benefits of additive manufacturing. From Time to Forbes to the Chicago Tribune, the consumer press has noticed that building components up instead of etching or milling away unwanted materials is going to transform manufacturing in many industries.

Many of these applications are in consumer products or other areas where failures aren’t critical. But additive processes are rapidly moving into high reliability areas. Pratt & Whitney, a manufacturer of turbine engines, is preparing to implement them on an engine that’s going into production for a new Bombardier jet.

P&W is using additive to make a curving tube that’s normally made by brazing several components together. This change is being monitored by the top executives. P&W president David Hess recently told a trade press gathering that “additive manufacturing has huge advantages from a cost standpoint.”

This rapid transition from inexpensive consumer parts to the high reliability demands of the aircraft industry could well occur in electronic products. Board fabricators are starting to use printed electronics to build up simple devices like heaters.

But as these additive circuit board technologies gain acceptance, it’s likely that they’ll be tweaked to work in high rel environments. After all, if metal tubes can work in the extremely stressful environment of a jet engine manifold, it seems plausible that the comparatively small volumes of conductive materials used on circuit boards can be designed to withstand their operating environment.

IPC is helping make sure that wherever they’re used, additive printed board processes efficiently move from design to production. Those who want to find out more about this rapidly advancing technology will find a lot of help from the IPC Printed Electronics Initiative.

By Terry Costlow | Posted in Boards, electronics, IPC, printed electronics | Tagged , , | Leave a Comment

Bob Willis Reviews New Technical Titles

May 23, 2013 – 9:50 am

Industry expert Bob Willis has tips on new reference books and IPC standards to help you do your job better.

View pdf summary here.

By Sandy Gentry | Posted in IPC, Standards, Technical | Tagged , , | Leave a Comment

Congressional Hearing: Unintended Consequences of Conflict Minerals Law

May 23, 2013 – 8:26 am

On Tuesday, May 22, in the U.S. House of the Representatives, the Committee on Financial Services Subcommittee on Monetary Policy and Trade held a hearing titled, “The Unintended Consequences of Dodd-Frank’s Conflict Minerals Provision.” In his opening statement, Subcommittee Chairman John Campbell (R-CA) noted that many Congolese derisively refer to Section 1502 as “Loi Obama” – Obama’s Law – because it has made economic conditions in the country worse without ending the violence.

David Aronson, a writer who has worked in central Africa throughout the past 25 years, testified that Section 1502 is “a case study in how good intentions can go awry.”  He added, “The law imposed a de facto embargo on mineral production that impoverished the region’s million or so artisanal miners.” Witnesses also emphasized there is no evidence that Section 1502 has reduced violence and that the roots of the conflict are much deeper and that industry cannot be part of the solution until the governments address the ongoing security issues. A number of Congressmen asked very pointed questions, including Congressman Mick Mulvaney (R-SC) who noted that no hearing was held on this topic before it was “slipped into” the Dodd-Frank legislation in 2010.

In May 2012, IPC Chairman of the Board Steve Pudles testified before the  Subcommittee on this issue stating, “IPC supports the underlying goal of Section 1502 — but quite frankly, I am concerned that the SEC’s draft regulations will have unintended negative consequences.”

IPC filed extensive comments on the Securities and Exchange Commission’s (SEC’s) regulations, including a comprehensive analysis of the financial impact on electronics manufacturers.  Since the promulgation of the rule, IPC has focused on helping member companies comply with the rule, most recently by publishing a compliance guide, and developing a data exchange standard.  Additionally, IPC will hold a workshop and conference on June 3–4 in Boston, Mass.

By Fern Abrams | Posted in Compliance, Government Relations, IPC, Regulations | Tagged , , , , | Leave a Comment

IPC Has Successful Meeting with Chinese Government on Cyanide Gold Plating Law

May 22, 2013 – 10:22 am

On May 17, 2013, IPC, along with Information Technology and Industry Council (ITIC) and the United States Information Technology Office (USITO), met with the National Development and Reform Commission (NDRC) of the People’s Republic of China to discuss concerns with a recent ruling that will ban cyanide gold plating in China after December 31, 2014.

In February 2013, the NDRC announced a revision of the “Guiding Catalogue for Adjustment Instructions for Cyanide Electrolytic Plating Processes.” Under the revision, which took effect May 1, 2013, gold cyanide plating will not be allowed in China after Dec 31, 2014. Although the revision cites an alternate citrate base gold plating chemistry, many PCB manufacturers and OEMs are concerned that these alternate chemistries have not been tested, used or validated for PCB production.

During the meeting on May 17, which was requested by IPC and other electronics associations earlier this month, the group provided further technical information and data to NDRC on the highly sophisticated technical requirements of gold plating application in the electronics sector and the need of careful evaluation of an alternative. Meeting participants also emphasized treatment and control technology in use worldwide to provide environmental safety for cyanide gold plating in electronics.

NDRC thanked participants for the positive tone of the meeting and asked them to provide more information and data on the technical issues discussed during the meeting.  IPC will continue to coordinate response from technical experts within our member companies.

By Fern Abrams | Posted in electronics, Environment, Health and Safety, IPC, Regulations | Tagged , , , | Leave a Comment

IPC Electronics Systems Technology Conference (IPC ESTC) Leads off with Back-to-back Home Runs

May 21, 2013 – 10:35 am

Dr. Tin-Lup Wong, distinguished engineer and executive director for Lenovo got IPC ESTC in Las Vegas off to a great start. Dr. Wong gave a keynote presentation that provided attendees an outstanding glimpse to the future of product development at Lenovo. Dr. Wong provided valuable insights to the challenges that ultraslim form factor is creating for the PC industry. Among the top challenges covered were battery technologies, manufacturing tolerances and reliability considerations when using thinner silicon technology.  Dr. Wong provided a vision of technical requirements for future designs and challenged the audience to go beyond the status quo in product and material technology. He also shared innovative approaches to making interconnects using anisotropic conductive films as well as fracture toughened glass for touch screen technology.

Dr. Wong was followed by Derrill Wolkins, director of product development at Medtronic. Wolkins provided insight into the unique challenges faced by the medical electronics industry.Medtronic’s innovative approach into looking beyond the device and looking to treating the “disease states” has led to medical electronics technology breakthroughs. Convergence of technologies for treatment of disease states have started to define next generation technology. Medtronic is taking a large interest in sensing technology combined with monitoring technology. These driving forces are making medical electronic devices smaller, simpler and secret. By combining the sensing technology with information technology, devices are becoming smarter as well. Wolkins shared the fundamental challenges of medical electronics devices such as size, longevity, regulatory issues, RoHS, and most importantly reliability.

Dr. Wong and Mr. Wolkins certainly set the stage for a great conference.  Long-time IPC Hall of Famer and industry expert, Gene Weiner, said this is the future direction of the electronics industry.  From silicon to final assembly, everyone in the supply chain will all need to work together to build the foundation for the next generation of electronics.

By Dave Torp | Posted in electronics, IPC, Technical, Trade Show | Tagged , , , , , | Leave a Comment
Follow

Get every new post delivered to your Inbox.

Join 123 other followers