Military cuts will have varied impact

Military markets have been fairly bullish over the past several years, but that’s changing rapidly. Over the next few years, one of the big challenges for any military supplier will be to determine where cuts are going to be made.

At this week’s AFCEA West 2012 exhibition, commanders from all branches shared one common element when they stood at the podium. Nearly every speaker mentioned budget cuts and the need to operate in a constrained environment.

The challenge will be to determine where cuts will come. The commander of the Naval Special Warfare Command, which lists the killing of Osama Bin Laden and the recent rescue of hostages in Somalia in its successes, predicts that his Seal teams won’t be hit too hard by budget cutters.

Similarly, the leader of the Navy’s Data Center Consolidation plan said his budget won’t be greatly impacted. He’s upgrading the information technology centers, eliminating many of them while moving the navy towards common industry platforms. His group is spending money now so the Navy won’t be wasting money by supporting 20 different operating systems on a host of incompatible server systems that are difficult and costly to maintain. Reducing the number of data centers will reduce manpower, which is one of the military’s major costs.

Satellite systems and unmanned vehicles are also expected to be fairly safe areas. But in a number of conversations with military and commercial satellite service suppliers, there was a note of skepticism about funding that wasn’t there a few months ago.

Budget cuts are definitely coming. There will be areas that avoid the axe, and some will undoubtedly get increased funding. It’s going to be challenging to determine how the cuts will impact projects throughout the electronics industry supply chain

Wanted: Expert Speakers – Make plans for 2012 today

IPC has released a call for papers for all scheduled conferences and events taking place this year. We invite you to take a look and consider participating as a speaker or sponsor at any of the following events. For more information, visit www.IPC.org/2012-call-for-participation.

IPC Tin Whiskers Conference
April 17-19
Ft. Worth, Texas
  
IPC Test and Inspection Conference
May 15–17
Orange County, California
  
IPC International Conference on Flexible Circuits
June 12-14
Irvine, California
  
IPC International Conference on HDI
October  24-25
El Segundo, California
  
IPC-SMTA High-Reliability Cleaning and Conformal Coating Conference
November 13-15
Chicago, Illinois

Plus, the call for papers for IPC Midwest has now been finalized. Get more informaton at www.IPCMidwestShow.org/cfp

IPC Midwest Technical Conference
August 22-23
Schaumburg (Chicago), Illinois

Building Long-term Reliability into Printed Circuit Boards

By Mike Carano, OMG Electrochemicals Inc.

The threat to the reliability of printed circuit boards (PCBs) comes primarily from one source — the temperatures required during the soldering processes for the assembly of the components onto the PCB. These reliability issues can be mitigated if fabricators understand the ramifications of the material sets chosen for the build as well as the chemical processes used in PCB fabrication. Some issues include PTH drilling parameters, multilayer board lamination, circuit density and PTH and blind via aspect ratios. Board lay-up and copper weights can influence the incidence of barrel cracking, innerlayer separation and Z-axis expansion. Some remedies include carefully matching the CTE of the material with the CTE of copper (as close as possible). Another option is to use higher performance materials with lower CTE and higher Tg. Of course, the additional cost must be considered when using these higher performance resin systems.  

In addition, which plating parameters have the greatest influence on long-term PCB reliability? Chemistry is certainly a factor but mechanical parameters including rectification, cell design and addition agent controls. Should one convert all of the plating cells to periodic pulse reverse plating? What will that move buy you? Are there other options to improve the plating process?  It is well known that improved overall plating distribution has many positive effects including improving the overall reliability of the plated-through holes and blind vias. Exceptional throwing power of the acid copper plating process is critical in providing increased thermal shock and thermal cycling resistance. One can improve throwing power with improved plating cell designs including anode configurations, proper selection of the rectifiers and the overall electrical connections. If set up properly, use of pulse plating with certain complex board designs will improve plating distribution and throwing power.

Laminate materials present special issues related to innerlayer treatment, lamination and electroplating. Some laminate materials are more brittle than others. This can reduce the bond strength in the multilayer boards. How should the fabricator approach the use of these more brittle materials in order to insure optimum reliability? Is conventional oxide more or less reliable than oxide alternative processes? To insure higher bond strengths with these more brittle materials, fabricators should play close attention to issues such as moisture absorption (both the innerlayers and pre-preg), instituting prelamination bake cycles of the innerlayer materials, and using longer lamination cycle times to insure proper resin flow and encapsulation. In addition, these higher performance materials require one to look at the operation of the innerlayer treatment process (conventional oxide versus oxide alternative). Here, the oxide or alternative oxide must be uniform and as thin as possible to give an optimum thermally heat resistant multilayer bond.

Finally, laminate materials contain fillers and other materials that can lead to poor plating adhesion on these materials. The fabricator must understand this and be prepared to use different methods to desmear the resin prior to plating. Drilling parameters must also be adjusted.

Mike will address these issues and more in his workshop on Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements, taking place at IPC APEX EXPO on Sunday, February 26.

Smart ideas for protecting intellectual property

Hackers and corporate thieves have helped make information security a topic that can’t be overlooked, especially in competitive fields like electronics. In North America, where many printed circuit board manufacturers target markets like defense and early prototyping, security is more critical than in areas that make high volume throw-away products.

For years, the two leading standards relevant to this industry have been ISO 27001, which establishes the parameters required for an information security management system and a companion document, ISO 27002, which outlines the best practices for companies that want to be certified as compliant.

“The standards provide a good base for companies that want to make sure that all the proprietary information they need to safeguard is protected,” said Duane Reeves, president of Gateway Security.

Now these ISO standards are being augmented with IPC-1071, Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing. Released last year, it focuses on the requirements of circuit board manufacturers.

One key element is that the data held by printed circuit board manufacturers is that the IP is often not owned by the board manufacturers themselves. Customers in competitive fields like defense and telecommunications need to know that their files aren’t going to be seen by anyone that doesn’t have authorized access.

“IPC has focused on best practices for the printed circuit board industry, it’s very specific to this industry, focusing on the large amount of data that board manufacturers hold for their customer’s products,” said Fern Abrams, IPC director of government relations and environmental policy.

Developed as a high-level roadmap to best industry practices for printed board manufacturers, IPC-1071 addresses physical and information security, employee data access, computer networks, destruction of scrap material and other important issues. It focuses on protection of the inherent IP designed into the printed board, from the customer to the printed board manufacturer. A certification program for IPC-1071 is in the works.

Reeves said that the standards address a broad range of security issues, from those that are fairly obvious to those that may not be considered by those who don’t take the time to fully analyze the many risks. “There are details like the disposal of equipment. Many printers have hard disk drives, people don’t realize that there’s a lot of data stored on them. Unless the drive is destroyed or the data is erased, anyone who gets that printer could potentially see crucial information,” he said.

New Issue of IPC Outlook Available: Head-in-Pillow Defects Featured Story

Please visit www.IPCOutlook.org to see the latest edition of IPC’s e-newsletter. Let us know what you think!

Nine Criteria for Selecting a Final Finish

By Mike Carano, OMG Electronic Chemicals, LLC

With so many final finish options available, how do the PCB fabricator, designer and assembler reconcile the best option to insure long term solder joint reliability under lead-free soldering conditions? What finish or finishes are best suited for fine pitch BGA as well as through-hole assembly?

 There are nine criteria that should be considered when selecting a final finish. These are:

  1.  What is the ultimate reliability requirement for the PCB? Atmosphere, environment, etc.
  2. How many assembly cycles will the board (and surface finish) be subjected to?
  3. Is ICT important for the finish?
  4. Are cosmetics a key attribute?
  5. Does the PCB eventually require wirebonding?
  6. Product life of the circuit board?
  7. Equipment considerations for final finish processing
  8. Is shock/drop testing a concern?
  9. Overall cost of the finish in comparison with the total board cost and required functionality

Selecting a final finish for your printed circuit boards may be one of the most important decisions you will ever make. Certainly, one should not select a finish solely on cost or because one likes the “look” of the finish.

Do you have additional criteria? Let me know what you think. I will address the criteria and more in my workshop  on February 26, 2012, at IPC APEX EXPO in San Diego.

Update on Securities and Exchange Commission Rulings on Conflict Metals

By Fern Abrams, IPC

The SEC has officially delayed its issuance of the regulation to implement the conflict minerals provision of the Dodd-Frank legislation.  It is now listed as an “Upcoming Activity” in the January-June 2012 time frame on its website.   SEC had previously indicated it would publish the rule before the end of 2011.  This means companies that report on a calendar year basis should have an additional year before having to report on their use of conflict minerals.

This welcome development was in large part due to the of IPC and its industry colleagues’ efforts – our comments to the SEC, meeting with the Commissioners, and calling on Congress to ask the SEC all played a key role in making sure the Commission and Congress understood the difficulties in complying with the regulations proposed by the SEC.  Of course, we will continue to urge the SEC to include the measures we proposed, such as an interim indeterminate origin category and a phased implementation, among others, in its final regulation.  A legal brief, filed by WilmerHale® on behalf of IPC, outlined the SEC’s authority to adopt a phase-in approach, by both virtue of the statutory text of Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act and the Commission’s general exemptive power under the Securities Exchange Act of 1934.

An October Tulane University economic analysis, which drew heavily on an IPC survey of the electronics industry, assessed the costs of implementing the Dodd-Frank conflict minerals regulation to be $7.93 billion — more than one hundred times greater than the estimate prepared by the U.S. Securities and Exchange Commission (SEC) of $71.2 million. The study, “A Critical Analysis of the SEC and NAM Economic Impact Models and the Proposal of a Third Model in View of the Implementation of Section 1502 of the 2010 Dodd-Frank Wall Street Reform and Consumer Protection Act,” was prepared at the request of U.S. Sen. Dick Durbin of Illinois, a co-sponsor of the conflict minerals provisions included in the Dodd-Frank Wall Street Reform and Consumer Protection Act.

According to Tulane graduate student Chris Bayer, “Evidence is the best guide, and our economic impact analysis of Dodd-Frank Section 1502 relies on findings from IPC’s 2011 survey.  The new law calls for transparency in the mineral sector supply chain and our paper suggests that its implementation will require significant effort on the part of affected companies.”

IPC’s report, “Results of an IPC Survey on the Impact of U.S. Conflict Minerals Reporting Requirements,” was part of a set of extensive comments submitted by IPC for the SEC’s Notice of Proposed Rulemaking. The survey, which was conducted by IPC’s market research department, collected data from 60 electronics manufacturing services companies, printed circuit board manufacturers, electronics materials suppliers and equipment suppliers.

IPC wishes to make clear that we share the world’s concerns about the human rights atrocities in the Democratic Republic of the Congo and supports efforts to bring peace and stability to the region. Unfortunately, due to the law of unforeseen consequences, we believe that the conflict minerals portion of Dodd-Frank will only increase the poverty and misery of the local people.

There was — and maybe still is — a responsible solution to the issue of conflict metals. Over the last three years, electronics industry groups and global metals associations have been working to “bag and tag” minerals from artisanal mines in the DRC. The DRC government supports this action as do other countries in the Great Lakes Region of Africa.

It’s not a perfect system, but it can work if it’s given time to be implemented. Unfortunately, the rush to source “conflict free” immediately can only serve to worsen the situation in the DRC. Right now, the only smelters that can be certified as “conflict free” are those that are not sourcing in the DRC or adjacent countries. We need to give these certification systems time to work.

The Tulane University economic analysis may be viewed at http://tinyurl.com/3bl8ntg. For more information about the IPC survey and IPC initiatives in the area of conflict minerals, visit www.ipc.org/minerals.  We also suggest reading our earlier post, Conflict Metals: Good Intentions Gone Tragically Bad.

Learn more: Steven McEuen, director of purchasing, Epic Technologies, Fern Abrams, director, government relations/environmental policy, IPC, Christopher Schwarz, associate, Canyon Snow Consulting LLC, and John Plyler, supply chain social responsibility program manager, will provide the latest information on the SEC regulations, guidance, and industry tools to help you meet legal and customer requirements at IPC APEX EXPO in a free session on Wednesday, February 29, in San Diego.

Burnish your skills in Budapest 20-22 March

With the new year beginning, make plans to do something new by attending the upcoming IPC Conference on Electronics Assembly in Budapest. The three-day event includes workshops, conference and a table-top exhibition. Learn more at www.ipc.org/budapest-conference.

Agenda

Tuesday, 20 March, 2012: Half-Day Workshops
8:00 Registration, Networking Breakfast
9:00 Workshop 1: Why Are My Solder Joints Not Perfect? Methods for Analyzing and Recommended Actions to Solve the Problem and to Ensure That It Will Not Happen Again
Instructor: Lars Wallin, IPC European Representative
9:00 Workshop 2: Cleaning Printed Circuit Assemblies, Design & Process Control Workshop
Instructor: Bob Willis, ASKbobwillis.com
13:30 Workshop 3: Steps for Practical Failure Analysis
Instructor: Bob Willis, ASKbobwillis.com
13:30 Workshop 4: How Can Flex and Flex Rigid Boards Be a Technical and Economic Success in Electronic Products? A Detailed Survey of Economic Calculations, Design Rules, Choice of Material and Production Parameters
Instructor: Lars Wallin, IPC European Representative
Wednesday, 21 March, 2012: Exhibits & Conference Sessions
7:30 Registration, Networking Breakfast
8:30 Issues Which Impact the Quality and Reliability of an Assembled Board
Lars Wallin, IPC European Representative
9:00 Which PCB Surface Finish is Best and What Are the Common Failure Modes During Assembly & Operation
Bob Willis, ASKbobwillis.com
9:45 Break, exhibits
10:30 Low Melting Point Lead-Free Soldering Materials to Eliminate Board Assembly Process Steps While Avoiding Design Changes
Corne Hopperbrouwers, European Automotive Technology Manager, Alpha
11:10 Reliability of Fluxes Used in Selective Soldering Processes
Han Raetzen, Area Sales & Support Manager, Balver Zinn
11:50 Cost Effective Soldering with Micro Alloyed Solder Reducing Dross
Jens Gruse, Application engineering, Stannol Gmbh
12:30 Networking Lunch
13:30 Challenges with Step Stencils in the Printing Process
Carmina Lantzsch, Sales, LaserJob
14:10 Stencil Technology — State of the Art?
Lothar Pietrzak, Director Sales/Marketing, Christian Koenen GmbH
14:50 Break, Exhibits
15:35 Will Global Environmental Regulations and Corporate Responsibility Impact Product Reliability?
Tony Hilvers, Vice President of Industry Programs, IPC
16:15 FREE Keynote Address: Reliability Issues for Advanced Electronic Products
Dr. Dongkai Shangguan, Vice President of Advanced Technology, Flextronics
17:00 Networking Reception, Exhibits
Thursday, 22 March 2012: Exhibits & Conference Sessions
7:30 Networking breakfast, exhibits
8:30 The Closed Loop Project Between Screen Printer and SPI by PARMI
Woong Jang, Sales Manager, Quiptech
9:10 Cleaning Highly Dense Circuit Assemblies
Serge Tuerlings, Technical Manager Europe, Kyzen
9:50 Break, Exhibits
10:35 Cleaning Electronic Assemblies in a No-Clean World
Mike Nelson, Managing Director, ETEK Europe
11:15 Next Generation Board Repair
Tom Berx, Area Sales Manager, Soldering Systems & Printing Machines, ERSA
11:55 Depaneling Printed Circuit Boards — Tools and Methods for Safely Singulating Panelized PCBs
Klaus Heimann, President, FKN Systek
12:35 Networking Lunch
13:35 Inline Automation Inspection — Don’t Find Defects Only; Control Your Process Quality! Use the Information Which SPI, AOI and AXI Provide to Observe Quality Features and to Take Corrective Action Before Defects Occur!
Michael Muegge, Sales Engineer, Viscom AG
14:15 Technology Breakthrough in 2-D X-Ray
Keith Bryant, Global Sales Director X-ray Systems, Nordson Dage
14:55 Break, Exhibits
15:10 3-D AOI Technology
Harald Eppinger, European Sales Manager, Koh Young Europe
15:50 Failure Analysis — Reduce Your Costs with a Specialized, Independent Laboratory
Peter Gordon, Managing Director, EFI-labs Europe
16:30 Optimization of Cleaning PCB Assemblies and Stencil Through Process Examination
Vladimír Sitko (PBT), ELAS Kft
17:10 Adjourn

FREE
Keynote Speaker: Dongkai Shangguan, Ph.D., MBA, IEEE Fellow
21 March, 16:15
Dr. Shangguan is vice president and senior fellow with Flextronics. He has published two books, more than 250 papers and articles, and has given numerous technical presentations. He has more than 20 U.S. and international patents issued and a number of U.S. and international patents pending.

Learn more: www.ipc.org/budapest-conference

IPC U.S. Offices will be closed on January 2, 2012

Happy new year! We look forward to working with you in 2012. Look for the launch this week of the new IPC Outlook newsletter. Catch a preview at www.IPCOutlook.org.

December Recap: New standards, translations, multimedia training and presentations

To help keep you apprised of new standards, we will be posting a monthly update here, on IPC’s Facebook page, our Linkedin Page and Twitter. We hope it will be helpful!

New standards releases:

  • IPC-4204A Flex Metal-Clad Dielectrics
  • IPC-2223C, Sectional Design Standard for Flexible Printed Boards
  • J-STD-006B-RU, Требования к припойным сплавам для электроники и твердым припоям с флюсом и без флюса для применения при пайке электроники (Russian Language)

New multimedia training releases:

  • DVD-ESD-K, ESD Fundamentals — Six-DVD Set
  • DVD-111C, Video Training on Advanced Hand Soldering Techniques – DVD-111C

New recorded presentations:

  • PLASMA-IRVINE-11-11, Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs
  • UNDERFIL-IRVINE11-11, Underfill Selection and the Impact on Reliability
  • EXESUM10-11-SUPCHAIN, Coping in an Era of Uncertainty – An Increasingly Agile Supply Chain and Lessons Learned from the Great Recession

New release announcement options:

You can sign up to receive all new release announcements or new releases only in English language, European languages or Asian languages. Learn more here.

More information on each new release can be found at www.ipc.org/onlinestore or our December New Releases page.

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