IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.

Component Traceability

The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working draft IPC-1782, Standard for Traceability of Critical Items Based on Risk. This standard will establish minimum requirements for traceability of items throughout the entire supply chain, with particular initial emphasis on component traceability through the manufacturing and assembly processes. This standard will also be used as a base document for a possible series of standards for traceability of other parts through the supply chain.

Base Materials

The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined and modified Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards. Amendment 2 is proposed by the European Space Agency to concentrate on laminate and prepreg of substantially lower contaminant level.  The proposed Amendment 2 will be composed of a newly constructed Appendix A which will be routed as a Final Draft for comment to all interested parties.

The 3-11f UL/CSA Task Group reviewed the 22 items for STP Ballot in UL 746E.  This Ballot will close on November 9, 2015.

The 3-11g Corrosion of Metal Finishes Task Group discussed work that IBM (Dr. P. J. Singh) has done with Flowers of Sulfur testing.

The 3-12a Metallic Foil Task Group addressed the non-contact surface roughness test (proposed TM 2.2.22).  Re-analysis of the round robin test data showed that the Gauge R & R was sufficient such that the proposed test method would be sent out as a Final draft for comment, once the test method verbiage was ‘cleaned up’.

The 3-12d Woven Glass Reinforcement Task Group reviewed spread glass data generated by JPS using weave style 1280 E-glass.  Three new weave styles were submitted for addition into the IPC-4412B Appendices II. – These will be routed as a Final Draft of an Amendment 2.  Finally, a minor change was noted to the group as to an IPC position statement concerning a European REACH treatment of boron trioxide as a Substance of Very High Concern.

Fabrication Processes

The 4-14 Plating Processes Subcommittee reviewed the latest draft of IPC-4552A, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards.  The group also reviewed the about-to-be released Amendment 1 to IPC-4556, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards.

Assembly and Joining

The 5-11c Electronic Assembly Adhesives Task Group recently approved for publication IPC-HDBK-4691, Handbook on Adhesive Bonding of Electronic Assembly Operations. The group will celebrate the publication when it meets at APEX/EXPO in Las Vegas. The task group will also begin review of orphaned Test Method 2.4.51 for dispersion of glass microbeads in self-shimming thermally conductive adhesives. The group will investigate if a similar industry test exists and also if glass microbeads in adhesives are still used on a regular basis.

The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at APEX 2016.

The 5-21f Ball Grid Array Task Group has begun work on the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. Items to be addressed in this revision include harmonization with the latest revisions of IPC-A-610 and J-STD-001, updating the Reliability section, supply chain issues and oxidation levels of ball surfaces.

The 5-21g Flip Chip Mounting Task Group continued its work on revision A to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The group is focusing on glob top, dam and fill, and frame and fill adhesives as well as reviewing submitted content and existing/new figures for the standard.

The 5-21h Bottom Termination Components Task Group broke ground on the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components and is seeing strong interest and support in upgrading the standard. Topics under consideration include consistency of product from multiple suppliers, addressing components 1 mm to 4 mm and inspecting microcracking and poor adhesion.

The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met a second day to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. The group also celebrated completion of the forthcoming J-STD-001 Revision F Amendment 1.

The 5-22ad Requirements for Military Systems Work Group met to discuss content to an addendum to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, that addresses hardware contracted by the U.S. Department of Defense and used in military systems.

The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group discussed the current status of round robin testing.

The 5-22as Task Group met to discuss an addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.

The 5-22f IPC-HDBK-001 Task Group celebrated the completion of the forthcoming revision to IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001, and discussed opening the document for an amendment to address changes as a result of J-STD-001F, Am 1.

The 5-23a Printed Circuit Board Solderability Specifications Task Group reviewed all comments submitted on the Amendment 1 to the J-STD-002D, including the substantial number from Jim Daggett of Raytheon.

The 5-23b Component and Wire Solderability Specification Task Group reviewed some potential changes to J-STD-003C that may just allow the people from DSCC to accept what could be the revision D of this standard.

The 5-24a Flux Specifications Task Group reviewed the SIR test method verification plan, including comparing the current J-STD-004 plan with the IEC round robin plan to determine the test board preparation procedures, specify the testing protocol and set the timing for the testing.

The 5-24b Solder Paste Task Group reviewed testing of solder balls, paste wetting and tackiness (tack) plus discussed rheometry testing using both parallel plate and spiral pump viscometers.

The 5-24c Solder Alloy Task Group discussed the addition of one more patented  lead free alloy to J-STD-006; the best way to address the addition of rare earth elements to lead free alloys and then discussed three IPC TM-650 test methods that will be placed in the 5-24c TG KAVI site for additional discussion by members of the task group.


U.S. Administration Releases Fall 2015 Unified Agenda of Federal Regulatory and Deregulatory Actions

On November 20, the U.S. Administration released its semiannual regulatory agenda, detailing the rules that federal agencies will make top priorities in the next year. The Fall 2015 Unified Agenda of Federal Regulatory and Deregulatory Actions contains hundreds of rules in the works at agencies across the government, including many that have been in the pipeline for years. The new agenda updates progress on many of the rules, providing new insight about the president’s regulatory priorities during his last months in office.

The Fall 2015 Unified Agenda reports on 3,297 rules and regulations at the “active,” “completed” and “long-term” stages, many of them holdovers from previous reports. This is down from 3,415 last year.

Of the Unified Agenda’s 3,000-plus rules in the pipeline, there is a costly subset deemed “economically significant.” These are projected to have economic effects of at least $100 million annually (usually upward, but sometimes downward). Economically significant rules and regulations went up in every category this past year, even as overall rule counts are lower. The Fall 2015 Unified Agenda reports on 218 “economically significant” rules and regulations at the “active,” “completed” and “long-term” stages.

IPC staff will be reviewing the agendas of key regulatory agencies including the Environmental Protection Agency, the Departments of Commerce, the Department of Labor, and working with the Government Relations and Environmental, Health and Safety Committees to review the status of rules affecting our membership.  IPC members are encouraged to review the agendas as well and contact IPC’s government relations staff with any concerns.

U.S. Congressman Bob Dold Tours Creation Technologies in Chicago

Today, U.S. Congressman Bob Dold (R-IL-10) met with executives and employees of IPC-member company Creation Technologies at the company’s manufacturing facility in Chicago, Illinois. Coordinated by IPC, the world’s leading association for electronics manufacturing companies, this visit is part of a nationwide effort to educate policymakers about legislative and regulatory issues that affect the electronics manufacturing industry.

“I am grateful to Creation Technologies and IPC for opening their doors today, giving me the opportunity to see firsthand the contributions that the electronics manufacturing industry makes to our economy,” said Congressman Dold. “As the fourth largest manufacturing district in the country, our workforce relies heavily on companies like Creation that are on the forefront of innovative new technologies.”

With facilities across the United States, Canada, Mexico, and China, Creation Technologies has decades of experience designing, manufacturing, and providing customized supply chain solutions to original equipment manufacturers (OEMs) around the world. The company’s Regional Manager, Ron Euer, hosted the site visit and led discussions on issues affecting the manufacturing industry, including fostering innovation, emerging markets, and regulatory compliance.

“On behalf of both Creation Technologies and IPC, I want to thank Congressman Dold for taking the time to visit our Chicago manufacturing facility today,” said Ron Euer. “Getting the opportunity to share our industry’s insights and experiences with him, in person, is a critical component of our longterm success. We are eager to keep working with him, and with IPC, to stimulate economic growth and innovation in Illinois and the U.S.”

Congressman Dold’s visit was part of IPC’s “Meet the Policymakers” program, through which IPC government relations staff arrange opportunities for IPC member-companies to host elected officials at company locations. This is the third visit in 2015 by a Member of Congress to Creation Technologies’ facilities. IPC member companies interested in hosting a legislator should contact IPC Vice President of Government Relations John Hasselmann at JohnHasselmann@ipc.org.

IPC Leads Joint Industry Comments on EPA TBBPA TSCA Plan

On October 18, 2015, IPC – Association Connecting Electronics Industries®, the Association of Home Appliance Manufacturers (AHAM), the Consumer Electronics Association (CEA), the Information Technology Industry Council (ITIC), and the National Electrical Manufacturers Association (NEMA) filed joint comments on the U.S. Environmental Protection Agency’s (EPA’s) TSCA Work Plan Chemical Problem Formulation of Tetrabromobisphenol A and Related Chemicals Cluster (Plan).

IPC and its fellow commenters voiced concern that the EPA’s Plan contains incomplete and inaccurate information regarding the uses of Tetrabromobisphenol A (TBBPA). The comments discussed in its main application (approximately 90 percent), TBBPA is chemically reacted to the epoxy resin upon which printed circuit boards (PCBs) are built. The comments note that EPA failed to distinguish between the additive and reactive uses of TBBPA and recommends that EPA separately delineate and assess, within any consumer exposure scenario, exposure as a result of additive and reactive uses of TBBPA. The comments also note that EPA has incorrectly interpreted studies regarding the presence of TBBPA in children’s products.

The comments encourage EPA to revise its planned assessment to more accurately assess use and exposure to TBBPA.


IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

IPC Standards Committee Reports

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports

Printed Board Design

The 1-10c Test Coupon and Artwork Generation Task Group met to review the newly developed Users Guide for the IPC-2221B Gerber Coupon Generator that will be released for use by the industry in late 2015.  The Generator allows for the creation of Gerber files for test coupon designs found in Appendix A of IPC-2221B, Generic Standard on Printed Board Design.  The group also reviewed a demo for a modification to the Gerber Coupon Generator for a propagated “D” coupon.

Cleaning and Coating

The 5-31g Stencil Cleaning Task Group met to work on IPC-7526, Stencil and Misprinted Board Cleaning Handbook. Sections 1 and 2 were revised. Material compatibility, snapback, dry vs wet wipe, nano-coating stencils, and small openings were among the subjects discussed.

The 5-31j Cleaning Compatibility Task Group met to discuss how to begin verification testing. They want to create acceptability levels for OEM and CM companies. Confirmation testing and test materials were discussed. Comments on document to be reviewed after the end of the year

The 5-32a Ionic Conductivity Task Group discussed the status of several ongoing projects involving Ion Chromatography. This includes: method detection limit round robin testing, IC Webinar for the SMART group from Doug Pauls, Rockwell Collins, updating WP-008, extract correlation study, localized extraction, and the J-STD-001 ROSE effort.

The 5-32b SIR and Electrochemical Migration Task Group met to discuss the statuses of several ongoing projects regarding SIR testing including: Round Robin study for hard wire vs test rack testing, discussion of several test methods, High Voltage SIR testing, and review of IPC-9203, B-52 Test Coupon User’s Guide.

The 5-32c Bare Board Cleanliness Assessment Task Group met to finalize the decisions made regarding five Test methods. A study was initiated to support the update of IPC-5704, Cleanliness Requirements for Unpopulated Boards in hopes of adding it as a requirement in IPC-6012, Performance of Rigid Printed Boards.

The 5-32e Conductive Anodic Filament (CAF) Task Group continued the revision of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

The 5-33a Conformal Coating Task Group met to work on Revision C of IPC-CC-830, Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies. DWV/MIR white paper was presented and decisions were made regarding what to include in CC-830C. The new Test Coupon, B-54, was presented. 5-33AWG also met to work on the CC-830 Handbook. Plexus presented pictures for use by the committee and Electrolube UK showed presentation on coating performance.

The 5-33g Low Pressure Molding Task Group continues to address the Draft of IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics.


The 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, StandS Group, for using XRF to determine phosphorous content in ENIG. There was a discussion of a Validation Process and Method Review for IPC methods. They proposed that the TAEC review all released Test Methods, new and revised. Also proposed that IPC could potentially provide validation for Test Method operators and auditing to ensure proper testing.

The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241, Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F, Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed.

The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM, Thermal Shock and 2.6.27, Thermal Stress. A PIN is to be drafted and discussed at the next teleconference.

Process Control

The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111, Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review.

Product Assurance

The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held in APEX 2016.

The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies.  The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1.

The 7-31bc Telecom Addendum Task Group met to continue discussions on the revision of the document. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document.

The 7-31f Task Group responsible for IPC-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, met to continue revision work on the document.

The 7-31j Task Group met to continue revising IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures.  The Task Group also discussed and approved a new title for the standard that will be introduced with the revision.

The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620.

The 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the working draft IPC-A-640 into separate standards for design (IPC-D-640) and acceptance (IPC-A-640). Because most of the content for the design document is already on hand, the group will focus first on IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on IPC-A-640 near that time, with a goal to publish later in 2016.

The 7-32c Electrical Continuity Task Group met to review industry responses to a survey on adjacency testing for bare printed board electrical test.  Additional input on the need to specify a minimum retention period for electrical test data and clarification on when electrical testing for Class 3 product can be agreed upon between user and supplier drove the group to determine that a “B” revision to the IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release.

The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies.

European Spotlight: Trends, Innovations, and Growth

IPC President and CEO John Mitchell discusses the growth of the electronics industry within Europe and how IPC supports IPC members through standards, education and advocacy efforts.



The New IPC Standards Gap Analysis Helps Your Bottom Line

How well do you know your manufacturing process? Are costly inconsistencies impacting your bottom line? IPC Standards Gap Analysis (SGA) is designed to enhance the financial success of IPC member companies. The service offered by IPC, examines your current manufacturing processes to uncover inconsistencies and provide a confidential report highlighting areas where improvements can be made.

Need to know more?

IPC is hosting a webinar to discuss our Standards Gap Analysis (SGA) and how it can benefit EMS companies. This complimentary webinar will focus on the different benefits of the SGA program, while highlighting areas where the analysis can help your company.

Join Randy Cherry, Director Validation Services, as he speaks on the many areas identified through the SGA program, and answers your questions to help best understand why this process is a necessity for modern companies. Topics discussed during the webinar will include:

  • Areas of the manufacturing process SMT Assembly, PTH Assembly, Incoming Inspection, Soldering
  • Evaluation of Personnel Proficiency, Operator/Inspector Activities and Training
  • Opportunities for process improvement ESD Practices, Lead free Assembly, Cleaning and Coating, Material Handling
  • Benefits of the SGA program
  • Increased knowledge of IPC standards requirements and using them in a manufacturing environment

SGA is designed to enhance your operational efficiency by examining current manufacturing processes to uncover costly inconsistencies. Register now for the SGA webinar and learn how this analysis can help increase production throughput and enhance the overall quality of finished goods.

Register for November 17, 2015 at 10:00am central time zone Webinar ID: 146-726-691 After registering, you will receive a confirmation email containing information about joining the webinar.

Register for November 19, 2015 at 3:00pm central time zone Webinar ID: 127-811-931 After registering, you will receive a confirmation email containing information about joining the webinar.

CCCMC and the OECD Draft Guidelines for Responsible Mineral Supply Chains in China

The China Chamber of Commerce of Metals, Minerals and Chemicals Importers & Exporters (CCCMC), in close cooperation with the multi-national Organization for Economic Cooperation and Development (OECD) has posted, for public comment, a draft of Chinese Due Diligence Guidelines for Responsible Mineral Supply Chains. The deadline for comment is October 31, 2015.  Information about the guidelines and links to Chinese and English versions are available on OECD’s website.  A brief summary of the guidelines is provided below.

The objective of the voluntary guidelines is to align Chinese company due diligence with international standards and allow for mutual recognition with existing international initiatives and legislations. The guidelines will apply to all companies owned, partially owned, registered in, or operating in China, which are using or are engaged at any point in the supply chain of minerals and related products.

The guidelines, which are based on OECD guidelines, detail five steps: establish sound risk management systems; identify and assess risk in the supply chain; design and implement a strategy to respond to identified risks; carry out independent third-party audit at identified risk points in the supply chain; and report on process and results of supply chain risk management.  The guidelines define two levels of risk, the first of which is defined as risks contributing to conflict and serious human rights abuses, as they are defined in the OECD Due Diligence Guidance. Type 2 Risks go beyond the risks outlined in the OECD Due Diligence Guidance. They include those risks relating to serious misconduct, as defined in the Chinese Responsible Mining Guidelines.

The guidelines also set up a program for certification of company due diligence efforts and include a model supply chain policy. In addition to these guidelines, CCCMC will release resource-specific audit protocols and supplementary materials which will provide detailed guidance for companies on how to carry out due diligence in the respective sectors.




Get Involved in Manufacturing Day 2015

MFGDaylogoManufacturing Day℠ (MFG DAY) is a celebration of modern North American manufacturing meant to inspire the next generation of manufacturers. Officially, MFG DAY occurs annually on the first Friday of October – this year is October 2, 2015 – but any day can be a Manufacturing Day!

Supported by a group of industry sponsors and co-producers – including IPC – MFG DAY addresses common misperceptions about manufacturing by helping companies open their doors and show, in a coordinated effort, what manufacturing is and isn’t. By working together before, during and after MFG DAY, manufacturers can address the skilled labor shortage we face, connect with future generations, take charge of our industry’s public image, and ensure the ongoing prosperity of the whole industry.

Getting involved in Manufacturing Day is easy, and there are many planning resources online at http://www.mfgday.com/resources. Some ways to get involved are:

  • Host an event, such as a community open house, plant tour, or education fair, at one of your facilities. Resources, like the Community Planning Guide and Educator Toolkit, are available to help you plan and execute a MFG DAY celebration in your community;
  • Participate in another company’s event in your community (there are over 1,900 events planned across the US, Canada, and Mexico), listed here; and
  • Engage in the social media conversation to share your exciting #MFGDay15 stories and photos! Utilize the Manufacturing Day Social Media Playbook to help you get connected online with MFG DAY. Be sure to follow IPC on social media for updates on the event and posts to share with your audience.

Manufacturing Day is just one of many ways to get involved and make an impact on important issues affecting your company and the manufacturing industry. If you are interested in getting further involved in IPC’s advocacy efforts, do not hesitate to reach out and contact Ken Schramko, IPC director of government relations, at KenSchramko@ipc.org.


World PCB Production in 2014 Estimated at $60.2 Billion

The world market for printed circuit boards (PCBs) reached an estimated $60.2 billion in value in 2014, growing just 0.7 percent in real terms, according to IPC’s World PCB Production Report for the Year 2014. Production growth in China, Thailand and Vietnam compensated for declining PCB production in most other regions. Developed by a team of the world’s leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating the volumes and types of PCBs being made in the world’s major producing countries.

The IPC report contains estimates of 2014 PCB production value by nine product categories and by 30 countries or sub-regions. Four categories of rigid PCBs, three categories of flexible circuits, and IC substrates are covered. The standard multilayer rigid PCB values are further segmented by those having microvia structures and those with non-microvia structures. The report also includes updates on metal-core PCBs, as well as regional trends and historical data on regional shifts in PCB production.

The data show that the worldwide rigid PCB market grew modestly in 2014, while flexible circuit growth was flat. Regional trends are also examined, including China’s slowing production growth and the spectacular growth in the PCB industries of Thailand and Vietnam.

“PCB production is an international business and the landscape continues to change,” says Sharon Starr, IPC director of market research. “Companies based in Taiwan, Japan and South Korea, are responsible for more than two-thirds of world PCB production. These and other companies around the world are powering the impressive growth of PCB production in southeast Asia.”

The team of industry analysts that produced the consensus estimates and contributed content for the report include: Dr. Hayao Nakahara, NTI; Michael Gasch, Data4PCB; Market Hutton, BPA Consulting; Francesca Stern, Francesca Stern Consulting; and Phil Plonski, Prismark Partners.

World PCB Production Report for the Year 2014 is available to IPC members for $475; the price for nonmembers is $950. For more information or to purchase the report, visit www.ipc.org/2014WorldPCB. For information on IPC market research programs, visit www.ipc.org/IndustryData or contact Sharon Starr, at +1 847-597-2817 or SharonStarr@ipc.org.


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