U.S. Congress Holds Briefing on National Network for Manufacturing Innovation

Yesterday, the four lead sponsors of the Revitalize American Manufacturing and Innovation (RAMI) Act (S. 1468 & H.R. 2996), Senators Sherrod Brown (D-OH) and Roy Blunt (R-MO), and Representatives Tom Reed (R-NY) and Joseph Kennedy (D-MA), jointly hosted a special congressional briefing on the National Network for Manufacturing Innovation (NNMI).

Secretary of Commerce, Penny Pritzker served as keynote speaker at the well-attended briefing. In addition, two panels were held. One panel consisted of companies that currently participate in the recently launched Institutes for Manufacturing Innovation (IMIs), which included Steve Betza, Lockheed Martin’s corporate director for Advanced Manufacturing & Development and member of the IPC Board of Directors. Betza told the audience that Lockheed Martin is a Tier 1 member at all four of the established IMIs and he discussed the high level of collaboration taking place. The second panel comprised representatives from three of the four IMIs that were established:

  • Digital Manufacturing and Design Innovation Institute,
  • America Makes – National Additive Manufacturing Innovation Institute, and
  • Lightweight and Modern Metals Manufacturing Innovation Institute.

The industry and institute panelists addressed the benefits and impacts of the NNMI, highlighted the activities of the four recently established IMIs, and expressed the need for the pending RAMI Act to be enacted into law. To help in understanding, a display area for the existing IMIs was set up, where congressional staff could witness firsthand innovative technologies like the 3-D printer in the National Additive Manufacturing Innovation Institute display.

IPC thanks Senators Brown and Blunt as well as Representatives Reed and Kennedy for their leadership on the RAMI Act.  This past Monday, the House of Representatives passed its version of the RAMI Act by voice vote.  IPC applauds the House action on the bill and strongly urges the Senate to pass its bill before Congress adjourns for the year.

RAMI Act Passes U.S. House of Representatives

RAMI Act

The Titan microscope, a cutting-edge technology in use at NC State.

Yesterday, the U.S. House of Representatives passed H.R. 2996 the Revitalize American Manufacturing and Innovation (RAMI) Act. Viewed as a critical piece of legislation in America’s renewed effort to preserve and recapture manufacturing jobs, the RAMI Act focuses efforts to spur innovation and capitalize on emerging manufacturing technologies.

“On behalf of IPC and our 2,200 U.S. member companies, I applaud the House of Representatives for working in a bipartisan manner to pass this critical piece of legislation,” said John Mitchell, president and CEO of IPC. “IPC urges the Senate to take similar action and pass its version of the bill before Congress adjourns for the year.”

A top policy priority for IPC, growing advanced manufacturing in the United States through federal investment is critical, and IPC strongly supports the RAMI Act. If enacted into law, the RAMI Act will establish a National Network for Manufacturing Innovation (NNMI). This network will consist of multiple centers for manufacturing innovation operating as public-private partnerships focusing on different technology areas to accelerate, strengthen and grow advanced manufacturing in the United States.

The bill was introduced in the House by Representatives Tom Reed (R-NY) and Joseph Kennedy (D-MA) in August of last year and passed the House today with an impressive number of 100 co-sponsors, 50 Democrats and 50 Republicans.

“Lockheed Martin is proud to be a charter member at all four Institutes for Manufacturing Innovation established to date,” said Steve Betza, Lockheed Martin’s corporate director for Advanced Manufacturing & Development and a member of the IPC Board of Directors. “These centers represent an unprecedented collaboration between government, industry and academia to accelerate manufacturing innovation. As such, we support the goal of the RAMI Act to expand the NNMI.” On September 18, Betza will participate in a Senate briefing to outline the benefits and impacts of the NNMI.

The U.S. Senate is considering its version of the RAMI Act (S. 1468), which was introduced during August 2013 by Senators Sherrod Brown (D-OH) and Roy Blunt (R-MO).

IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny.

These coatings have typically been applied and examined using a range of related standards. For example, IPC-CC-830 addresses some basic testing of materials properties, while IPC J-STD-001 and IPC-A-610 define how a cured film should look.

A new IPC working group, 5-33awg, Conformal Coating Requirements Working Group, was formed to leverage the considerable amount of coating experience of the 5-33c IPC Conformal Coating Handbook Task Group, and focus on areas not covered by existing specifications. Among their areas of interest are the differences in the ways that an aerospace OEM might test coatings for NASA for outer space, or for the FAA’s tests on humidity condensation. Testing automotive OEM coatings in a damp heat environment is another area being examined.

5-33awg is working to develop criteria for conformal coating application and evaluation. Its goal is to come up with methods that allow a user of conformal coating to determine how conformal coating performs in particular end-use environments.

The group’s work is ongoing. Those interested in joining the working group can contact Kris Roberson, IPC manager of assembly technology.

 

The Road to DFX

IPC President and CEO John Mitchell discusses a new IPC initiative: IPC DFX — Design for Excellence program and the advances the design community has seen over the years due to the leadership and contributions of the late, great Dieter Bergman.

 

 

Department of Commerce Publishes Conflict Mineral Smelter List

On September 5, 2014, The U.S. Department of Commerce published a list of known conflict mineral processing facilities, as required under Section 1502(d)(3)(C) of the Dodd-Frank Wall Street Reform and Consumer Protection Act (Dodd-Frank Act).

The U.S. government finally acknowledged Friday it cannot determine which refiners and smelters around the world are financially fueling violence in the war-torn Congo region.

While the list identifies more than 400 sites from Australia to Brazil and Canada, the Department of Commerce report states that it “does not have the ability to distinguish” which are being used to finance conflict in the Democratic Republic of the Congo (DRC) or adjacent countries.

The Department missed its original January 2013 deadline, under the 2010 Dodd-Frank Act, to list “all known conflict mineral processing facilities world-wide.” A June 26, 2014 report by the Government Accountability Office blasted the department for the delay.

According to a September 8, 2014 article in the Wall Street Journal, “The inconclusive report underscores the challenges faced by hundreds of U.S. public companies that also had to comply with the rule and file reports on their efforts to discover conflict minerals in their supply chains.”

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated

conformal-coating-targetF’ Revisions Cover More Advanced Technologies

IPC has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity. New photos facilitate further understanding.

The revision process involved dedicated volunteers from electronics companies in the Americas, Europe and Asia. With the mantra, “in data we trust,” IPC committee members focused major changes in areas such as the shrinking sizes of plastic packages that affect solder touching component bodies.

Dispelling past concerns that solder could not touch plastic components for fear of future failure, Teresa Rowe, IPC director of assembly technology, said “We [committee] didn’t find significant occurrences of failures when solder touched the plastic bodies.” Rowe explains that there was much discussion on this topic and expects that as research in this area continues, the committee will consider it in future revisions.

The chapter on conformal coatings also underwent significant changes. “We revised the way we look at conformal coatings, providing new information on coating thickness,” Rowe said. “We also looked at bubbles, voids and transparency, expanding our criterion for acceptance.”

The standards also cover Class 2 plated-through hole vertical solder fill requirements and Class 2 flux activity criteria.

Often used as companion documents, IPC J-STD-001F and IPC-A-610F each has a unique purpose. Whereas IPC J-STD-001 is a material and process requirements document and is critical for use during manufacturing, IPC-A-610 is a post-assembly acceptance standard.

Translations of the F revisions and training programs based on the revised standards will be released in the coming months. For more information on IPC J-STD-001F, visit www.ipc.org/001; for more information on IPC-A-610F, visit www.ipc.org/610 or contact Rowe at TeresaRowe@ipc.org or +1 847-597-2838.

North American Labor Pool – How Well Does it Meet the Needs of Electronics Manufacturers?

IPC is conducting an in-depth study of the North American labor pool to assess how well it meets the needs of electronics manufacturers, identify and verify the gaps, and discover how manufacturers are overcoming recruitment challenges. Information is being gathered from industry, education and government through interviews, surveys and published sources.

You can be a part of this ground-breaking research by participating in IPC’s industry survey at IPC Labor Pool Survey by September 20. It should take about 10 minutes, depending upon how much you wish to share.

All electronics manufacturers in the USA and Canada are encouraged to participate. Even if you are not experiencing a skills shortage, we need to hear your perspectives too. Participants will receive a summary of the survey results before the full report is published.

Your contributions to this study will be greatly appreciated.

 

IPC and IEC Establish Closer Working Ties to Further Printed Electronics Industry

IPC was recently notified that the International Electrotechnical Commission’s (IEC’s) Standardization Management Board (SMB) “…approved the category D liaison between IEC TC 119 WG 2 and IPC…” A representative expert in the field to serve as the focal point of collaborative efforts has been nominated, and approval is pending.

This approval represents the culmination of direct efforts by many within IPC and the industry for more than a year, and recognizes IPC’s capacity for technical contribution on a multinational basis in the creation of international standards in the growing printed electronics industry. To quote from the IEC Directives:

“1.17.3.4 Rights and obligations

Category D liaison organizations have the right to participate as full members in a working group (see 1.12.1).

Category D liaison experts act as the official representative of the organization by which they are appointed.”

IPC believes this will guarantee that our member companies’ needs are best represented to the international community, and will help eliminate the possibility of conflicting or competing standards that might hinder the free exercise of global trade in this growing market. In addition, this result directly supports the IPC mission statement to commit “… full cooperation with all related organizations…” and underscores the collaborative spirit among the early participants in the global printed electronics community.

IPC looks forward to the even closer cooperation this liaison status facilitates, and believes this is an important step toward successful acceptance of printed electronics technology as one more useful option in the larger electronics industry.

For more information, visit the IPC Printed Electronics Initiative  Web page or contact Marc Carter, IPC director, Technology Transfer.

 

Teresa Rowe Aims to Help Committee Chairs Grow

Teresa Rowe has seen a lot of value in IPC’s programs over the past couple decades. They helped her advance in her career, and she’s helped write documents that provide the foundations for continued electronics industry growth. She learned a lot about technology while serving on 25 IPC committees, but that knowledge isn’t what she thinks about first.

Instead, Rowe focuses on her growth as a manager. After attending IPC meetings for years, she tackled the role of chair. It went well, and she chaired more committees, honing her management skills along the way. These skills paid off in her career, she became director of quality for logistics and technical services at AAI (Textron Systems subsidiary), an aerospace and defense development and manufacturing firm.

Recently, Rowe joined IPC as director of assembly and standards technology. Along with directing the development of standards for electronics assembly materials and processes, she’ll be supporting committee chairmen. That support will include some concepts she acquired in her role as a Certified IPC Trainer for four IPC programs.

In this new role, she’s excited about helping other people in chair positions and helping them grow. Rowe noted that when she took her first job as chairwoman, she led the IPC J-STD-001 C Revision. Now, the F Revision is about to be released. She’s undergone a number of changes, becoming “a totally different person” during those revisions. In her new role as an IPC liaison, she’ll be helping others through their personal and career growth.

Trade Show Pact Ensures “Building through Resilience”

IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair last year (IPC & HKPCA Show), the two agreed to co-host the event for four more years.

The show will be held in Shenzhen, China, December 3–5, 2014. Last year, IPC and HKPCA partnered to make the exhibition an enormous success.

“The cooperative effort in Hong Kong is now the largest trade show in the world in the PCB industry,” said Philip Carmichael, president of IPC Greater China.

Last year, the show hosted 499 exhibiting companies, 2,000 booths and occupied 300,000 square feet of space. This event attracted 41,831 attendees.

The two associations are being helped by the China Council for the Promotion of International Trade Guangzhou Sub-council. IPC is also producing a number of smaller trade shows and conferences in Asia, providing training, education and industry standards expertise to help companies and individual attendees.

Carmichael noted that the 2014 theme, “Building through Resilience,” conveys what our industry is seeing in China. “Steady growth, new technology and the resilience to take on new challenges in the competitive global printed board industry are all part of China’s business environment,” he added.

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